公开(公告)号：US11118056B2

公开(公告)日：2021-09-14

申请号：US16319639

申请日：2017-07-20

Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC

Inventor： Daigo Hirakawa ,  Masanori Takanashi ,  Isao Iida ,  Kenji Takenaka ,  Eiji Tanigawa

IPC: C08L83/04 ,  C08G77/08 ,  C08G77/12 ,  C08G77/18 ,  C08G77/20 ,  C08G77/00 ,  C08K3/22 ,  C08K3/28

Abstract: A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, and (B) at least one member selected from the group consisting of an alkoxysilyl group-containing compound and a dimethylpolysiloxane. The component (A) includes at least two thermally conductive fillers having different average particle diameters, and (A-1) indefinite-shaped aluminum nitride particles having an average particle diameter of 30 μm to 150 μm in an amount of at least 20% by mass, based on the mass of a total of the component (A).

公开(公告)号：US11286349B2

公开(公告)日：2022-03-29

申请号：US16319624

申请日：2017-07-20

Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC

Inventor： Eiji Tanigawa ,  Masanori Takanashi ,  Isao Iida ,  Daigo Hirakawa ,  Kenji Takenaka

IPC: C08G77/18 ,  C08G77/50 ,  C08K3/013 ,  C08K9/06 ,  C08G77/04

Abstract: A siloxane compound represented by the general formula (1): where R1 is a group having an alkoxysilyl group having 1 to 4 carbon atoms, R2 is a linear organosiloxy group represented by the general formula (2): where each R4 is independently a monovalent hydrocarbon group having 1 to 12 carbon atoms, Y is a monovalent hydrocarbon group having 1 to 6 carbon atoms, and d is an integer of 10 to 50, each X is independently a divalent hydrocarbon group having 2 to 10 carbon atoms, each of a and b is independently an integer of 1 or more, c is an integer of 0 or more, a+b+c is an integer of 4 or more, and each R3 is independently a monovalent hydrocarbon group having 1 to 6 carbon atoms.

公开(公告)号：US09034993B2

公开(公告)日：2015-05-19

申请号：US13928820

申请日：2013-06-27

Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC

Inventor： Koki Otashiro ,  Isao Iida

IPC: C08K3/36 ,  C09J183/04 ,  C08G77/16 ,  C08K5/544 ,  C08G77/18 ,  C08K9/06

CPC classification number: C08K3/36 ,  C08G77/16 ,  C08G77/18 ,  C08K5/544 ,  C08K9/06 ,  C08L83/00 ,  C09J183/04

Abstract: A room temperature-curable polyorganosiloxane composition is a two component-type room temperature-curable polyorganosiloxane composition including (A) a base composition and (B) a cross-linking agent composition. The component (A) contains (a1) polyorganosiloxane having a hydroxyl group or an alkoxy group at a molecular end and (a2) an inorganic filler. The component (B) includes (b1) an organosilicon compound having three or more hydrolyzable groups in one molecule, (b2) polyorganosiloxane having an alkoxy group at a molecular end and represented by the following general formula and, and (b3) a curing catalyst. In the two component-type room temperature-curable polyorganosiloxane composition, it is possible to appropriately adjust a compounding ratio of the base component and the cross-linking component according to the use of an automatic mixer/discharger or the like without deteriorating properties such as deep-part curability, curing uniformity, and storage stability.

Abstract translation: 室温固化性聚有机硅氧烷组合物是包含（A）基础组合物和（B）交联剂组合物的双组分型室温固化型聚有机硅氧烷组合物。 组分（A）含有（a1）分子末端具有羟基或烷氧基的聚有机硅氧烷，（a2）无机填料。 组分（B）包括（b1）在一个分子中具有三个或更多个可水解基团的有机硅化合物，（b2）分子末端具有烷氧基并由以下通式表示的聚有机硅氧烷，和（b3）固化催化剂 。 在双组分型室温固化型聚有机硅氧烷组合物中，可以根据使用自动混合器/放电机等适当地调整基础成分和交联成分的配合比例，而不会劣化诸如 深部固化性，固化均匀性和储存稳定性。

公开(公告)号：US11739245B2

公开(公告)日：2023-08-29

申请号：US16319612

申请日：2017-07-20

Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC

Inventor： Masanori Takanashi ,  Isao Iida ,  Daigo Hirakawa ,  Kenji Takenaka ,  Eiji Tanigawa

IPC: C09K5/14 ,  C08G77/08 ,  C08G77/12 ,  C08G77/18 ,  C08K3/22 ,  C08K3/28 ,  H05K7/20 ,  C08G77/20

CPC classification number: C09K5/14 ,  C08G77/08 ,  C08G77/12 ,  C08G77/18 ,  C08K3/22 ,  C08K3/28 ,  H05K7/2039 ,  C08G77/20 ,  C08K2003/2227 ,  C08K2003/282 ,  C08K2201/001

Abstract: A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, (B) a polyorganosiloxane resin including at least one polysiloxane having one curable functional group in the molecule thereof, and (C) a siloxane compound having an alkoxysilyl group and a linear siloxane structure.

公开(公告)号：US10160883B2

公开(公告)日：2018-12-25

申请号：US15190916

申请日：2016-06-23

Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC

Inventor： Isao Iida ,  Takeshi Sunaga

IPC: C08L83/00 ,  C08L83/06 ,  C09D183/06 ,  C08G77/18 ,  B05D1/02

Abstract: There is provided a room-temperature-curable polyorganosiloxane composition having low viscosity and good coatability without any solvent and forming a cured coating film excellent in scratch resistance. The room-temperature-curable polyorganosiloxane composition contains: (A) 100 parts by mass of a mixture of (A1) 10 to 80 parts by mass of a polyorganosiloxane having two or more alkoxy groups bonded to silicon atoms and a prescribed viscosity, and (A2) 90 to 20 parts by mass of a polyorganosiloxane represented by an average composition formula: R1aSi(OR2)bO{4−(a+b)}/2 (R1 and R2 represent prescribed group respectively, and a and b are prescribed positive numbers), having an Mw of 2,000 to 100,000 and a three-dimensional network structure, and being in a solid state or in a semisolid state at normal temperature; and (B) 0.1 to 15 parts by mass of an organic titanium compound.

公开(公告)号：US11254849B2

公开(公告)日：2022-02-22

申请号：US15772690

申请日：2016-11-02

Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC

Inventor： Eiji Tanigawa ,  Masanori Takanashi ,  Isao Iida ,  Daigo Hirakawa ,  Kenji Takenaka

IPC: C08K9/06 ,  C09K5/14 ,  H01L23/36 ,  C08L83/04 ,  H01L23/373 ,  C08J3/20 ,  C08K9/08 ,  C08G77/20 ,  C08K3/22 ,  C09C3/12

Abstract: A method for producing a polyorganosiloxane resin composition including: (a) mixing a thermally-conductive filler having a particle size distribution having a single peak, with a surface treatment agent containing a siloxane to form a mixture, and (b) mixing the mixture from step (a) with a polysiloxane resin.

公开(公告)号：US20130303676A1

公开(公告)日：2013-11-14

申请号：US13928820

申请日：2013-06-27

Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC

Inventor： Koki Otashiro ,  Isao Iida

IPC: C08K3/36

CPC classification number: C08K3/36 ,  C08G77/16 ,  C08G77/18 ,  C08K5/544 ,  C08K9/06 ,  C08L83/00 ,  C09J183/04

Abstract: A room temperature-curable polyorganosiloxane composition is a two component-type room temperature-curable polyorganosiloxane composition including (A) a base composition and (B) a cross-linking agent composition. The component (A) contains (a1) polyorganosiloxane having a hydroxyl group or an alkoxy group at a molecular end and (a2) an inorganic filler. The component (B) includes (b1) an organosilicon compound having three or more hydrolyzable groups in one molecule, (b2) polyorganosiloxane having an alkoxy group at a molecular end and represented by the following general formula and, and (b3) a curing catalyst. In the two component-type room temperature-curable polyorganosiloxane composition, it is possible to appropriately adjust a compounding ratio of the base component and the cross-linking component according to the use of an automatic mixer/discharger or the like without deteriorating properties such as deep-part curability, curing uniformity, and storage stability.

Abstract translation: 室温固化性聚有机硅氧烷组合物是包含（A）基础组合物和（B）交联剂组合物的双组分型室温固化型聚有机硅氧烷组合物。 组分（A）含有（a1）分子末端具有羟基或烷氧基的聚有机硅氧烷，（a2）无机填料。 组分（B）包括（b1）在一个分子中具有三个或更多个可水解基团的有机硅化合物，（b2）分子末端具有烷氧基并由以下通式表示的聚有机硅氧烷，和（b3）固化催化剂 。 在双组分型室温固化型聚有机硅氧烷组合物中，可以根据使用自动混合器/放电机等适当地调整基础成分和交联成分的配合比例，而不会劣化诸如 深部固化性，固化均匀性和储存稳定性。

公开(公告)号：US11814521B2

公开(公告)日：2023-11-14

申请号：US17357690

申请日：2021-06-24

Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC

Inventor： Atsushi Sakamoto ,  Isao Iida

IPC: C08L83/04 ,  C08K3/28 ,  C08K3/013 ,  C08L83/06 ,  C08G77/12 ,  C08G77/20

CPC classification number: C08L83/04 ,  C08K3/013 ,  C08K3/28 ,  C08L83/06 ,  C08G77/12 ,  C08G77/20 ,  C08K2003/282 ,  C08K2201/001 ,  C08K2201/003 ,  C08L2203/206 ,  C08L83/04 ,  C08L83/00 ,  C08L83/00 ,  C08K5/56 ,  C08K3/22

Abstract: A thermally conductive polysiloxane composition comprising: (A) a thermally conductive filler; (B) a polyorganosiloxane resin having a curable functional group in the polysiloxane molecule, the polyorganosiloxane resin comprising at least one polysiloxane (b1) having one curable functional group in the molecule thereof; (C) a siloxane compound having an alkoxysilyl group and a linear siloxane structure; (D) a hydrogenpolyorganosiloxane; and (E) a platinum catalyst, wherein the content of the polysiloxane (b1) having one curable functional group in the molecule thereof in the polyorganosiloxane resin (B) is more than 80% by mass.

公开(公告)号：US11084927B2

公开(公告)日：2021-08-10

申请号：US16319639

申请日：2017-07-20

Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC

Inventor： Daigo Hirakawa ,  Masanori Takanashi ,  Isao Iida ,  Kenji Takenaka ,  Eiji Tanigawa

IPC: C08L83/04 ,  C08G77/08 ,  C08G77/12 ,  C08G77/18 ,  C08G77/20 ,  C08G77/00 ,  C08K3/22 ,  C08K3/28

Abstract: A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, and (B) at least one member selected from the group consisting of an alkoxysilyl group-containing compound and a dimethylpolysiloxane. The component (A) includes at least two thermally conductive fillers having different average particle diameters, and (A-1) indefinite-shaped aluminum nitride particles having an average particle diameter of 30 μm to 150 μm in an amount of at least 20% by mass, based on the mass of a total of the component (A).