Invention Grant
- Patent Title: Optical sensor module and method for manufacturing the same
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Application No.: US16404337Application Date: 2019-05-06
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Publication No.: US11257799B2Publication Date: 2022-02-22
- Inventor: Hsin-Ying Ho
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L25/16
- IPC: H01L25/16 ; H01L31/12 ; H01L31/0203 ; H01L31/0232 ; H01L31/167 ; H01L31/173 ; H02S40/44 ; G01S7/481 ; G01S17/04

Abstract:
An optical sensor module includes: (1) a lid defining a first chamber and a second chamber isolated from the first chamber; (2) a light emitting component disposed within the first chamber; and (3) a light sensing component disposed within the second chamber; wherein the lid includes a capping substrate and a top of the first chamber and a top of the second chamber are demarcated by the capping substrate, wherein the capping substrate defines a first penetrating hole at the top of the first chamber and a first runner connecting a side wall of the first penetrating hole, and wherein a first lens or a first transmissive panel is formed or disposed in the first penetrating hole and has an extension formed or disposed in the first runner connecting the side wall of the first penetrating hole.
Public/Granted literature
- US20190259741A1 OPTICAL SENSOR MODULE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2019-08-22
Information query
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