Invention Grant
- Patent Title: Artifactless superelastic alloy
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Application No.: US16641146Application Date: 2018-08-09
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Publication No.: US11268168B2Publication Date: 2022-03-08
- Inventor: Hideki Hosoda , Akira Umise , Kenji Goto
- Applicant: TOKYO INSTITUTE OF TECHNOLOGY , TANAKA KIKINZOKU KOGYO K.K.
- Applicant Address: JP Tokyo; JP Tokyo
- Assignee: TOKYO INSTITUTE OF TECHNOLOGY,TANAKA KIKINZOKU KOGYO K.K.
- Current Assignee: TOKYO INSTITUTE OF TECHNOLOGY,TANAKA KIKINZOKU KOGYO K.K.
- Current Assignee Address: JP Tokyo; JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JPJP2017-159554 20170822
- International Application: PCT/JP2018/029910 WO 20180809
- International Announcement: WO2019/039298 WO 20190228
- Main IPC: C22C5/02
- IPC: C22C5/02 ; B21D22/02 ; B22D7/00 ; C22C1/02 ; C22F1/14

Abstract:
The present invention provides an artifactless superelastic alloy including a Au—Cu—Al alloy, the superelastic alloy containing Cu in an amount of 20 atom % or more and 40 atom % or less, Al in an amount of 15 atom % or more and 25 atom % or less, and Au as a balance, the superelastic alloy having a bulk magnetic susceptibility of −24 ppm or more and 6 ppm or less. The Ni-free superelastic alloy of the present invention is capable of exhibiting superelasticity in a normal temperature range, and hardly generated artifacts in a magnetic field environment. The alloy can be produced by setting a casting time in a melting and casting step to a fixed time, and hot-pressing an alloy after casting to make material structures homogeneous.
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