Invention Grant
- Patent Title: Laminate structure and test method for detecting inter-metal dielectric layer defects
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Application No.: US16423040Application Date: 2019-05-27
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Publication No.: US11270918B2Publication Date: 2022-03-08
- Inventor: Xiong Zhang , Chunlai Sun , Peichun Wang , Gang Shi
- Applicant: MONTAGE TECHNOLOGY CO., LTD.
- Applicant Address: CN Shanghai
- Assignee: MONTAGE TECHNOLOGY CO., LTD.
- Current Assignee: MONTAGE TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shanghai
- Agency: Jun He Law Offices P.C.
- Agent James J. Zhu
- Priority: CN201810531795.7 20180529
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L23/544

Abstract:
The present application disclosed a conducting layer-dielectric layer-conducting layer (CDC) laminate structure and test method for detecting defects of an inter-metal dielectric layer. The laminate structure comprises: a dielectric layer formed on a substrate; a first conducting layer formed at a first side of the dielectric layer, wherein the first conducting layer includes a first metal region and at least one first opening in the first metal region; and a second conducting layer formed at a second side of the dielectric layer opposite to the first conducting layer such that the second conducting layer is separated from the first conducting layer by the dielectric layer, wherein the second conducting layer includes a second metal region and a plurality of second openings in the second metal region. The at least one first opening and the plurality of second openings are configured that a projection of the second metal region on the first conducting layer at least partially overlaps with the first metal region.
Information query
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