Invention Grant
- Patent Title: Epoxy resin wave-absorbing composite material and preparation method thereof
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Application No.: US16695352Application Date: 2019-11-26
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Publication No.: US11279822B2Publication Date: 2022-03-22
- Inventor: Ruopeng Liu , Zhiya Zhao , Miao Yin , Lu Zhang , Yan Hou , Yunxiang Zhang , Zhonghao Qiu , Xue Li
- Applicant: LUOYANG INSTITUTE OF CUTTING-EDGE TECHNOLOGY , LUOYANG INSTITUTE OF CUTTING-EDGE TECHNOLOGY LTD
- Applicant Address: CN Henan; CN Henan
- Assignee: LUOYANG INSTITUTE OF CUTTING-EDGE TECHNOLOGY,LUOYANG INSTITUTE OF CUTTING-EDGE TECHNOLOGY LTD
- Current Assignee: LUOYANG INSTITUTE OF CUTTING-EDGE TECHNOLOGY,LUOYANG INSTITUTE OF CUTTING-EDGE TECHNOLOGY LTD
- Current Assignee Address: CN Henan; CN Henan
- Agency: Cantor Colburn LLP
- Priority: CN201710386665.4 20170526
- Main IPC: C08L63/00
- IPC: C08L63/00 ; C08G59/50 ; C08K9/06 ; C08K3/04 ; C08K3/40

Abstract:
The present disclosure provides an epoxy resin wave-absorbing composite material and a preparation method thereof. The method includes: heating an epoxy resin to 50° C.˜70° C., and adding carbon black, to obtain a mixture of the epoxy resin and the carbon black; heating the mixture of the epoxy resin and the carbon black to 100° C.˜120° C., adding a curing agent, and stirring and dissolving them to obtain a mixture of the epoxy resin, the carbon black, and the curing agent; and adding surface-treated hollow glass microbeads into the mixture of the epoxy resin, the carbon black, and the curing agent, and curing them to obtain the epoxy resin wave-absorbing composite material.
Public/Granted literature
- US20200095419A1 EPOXY RESIN WAVE-ABSORBING COMPOSITE MATERIAL AND PREPARATION METHOD THEREOF Public/Granted day:2020-03-26
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