公开(公告)号：US11279822B2

公开(公告)日：2022-03-22

申请号：US16695352

申请日：2019-11-26

Applicant: LUOYANG INSTITUTE OF CUTTING-EDGE TECHNOLOGY ,  LUOYANG INSTITUTE OF CUTTING-EDGE TECHNOLOGY LTD

Inventor： Ruopeng Liu ,  Zhiya Zhao ,  Miao Yin ,  Lu Zhang ,  Yan Hou ,  Yunxiang Zhang ,  Zhonghao Qiu ,  Xue Li

IPC: C08L63/00 ,  C08G59/50 ,  C08K9/06 ,  C08K3/04 ,  C08K3/40

Abstract: The present disclosure provides an epoxy resin wave-absorbing composite material and a preparation method thereof. The method includes: heating an epoxy resin to 50° C.˜70° C., and adding carbon black, to obtain a mixture of the epoxy resin and the carbon black; heating the mixture of the epoxy resin and the carbon black to 100° C.˜120° C., adding a curing agent, and stirring and dissolving them to obtain a mixture of the epoxy resin, the carbon black, and the curing agent; and adding surface-treated hollow glass microbeads into the mixture of the epoxy resin, the carbon black, and the curing agent, and curing them to obtain the epoxy resin wave-absorbing composite material.

公开(公告)号：US20200095419A1

公开(公告)日：2020-03-26

申请号：US16695352

申请日：2019-11-26

Applicant: LUOYANG INSTITUTE OF CUTTING-EDGE TECHNOLOGY ,  LUOYANG INSTITUTE OF CUTTING-EDGE TECHNOLOGY LTD

Inventor： Ruopeng LIU ,  Zhiya ZHAO ,  Miao YIN ,  Lu ZHANG ,  Yan HOU ,  Yunxiang ZHANG ,  Zhonghao QIU ,  Xue LI

IPC: C08L63/00 ,  C08K9/06 ,  C08G59/50

Abstract: The present disclosure provides an epoxy resin wave-absorbing composite material and a preparation method thereof. The method includes: heating an epoxy resin to 50° C.˜70° C., and adding carbon black, to obtain a mixture of the epoxy resin and the carbon black; heating the mixture of the epoxy resin and the carbon black to 100° C.˜120° C., adding a curing agent, and stirring and dissolving them to obtain a mixture of the epoxy resin, the carbon black, and the curing agent; and adding surface-treated hollow glass microbeads into the mixture of the epoxy resin, the carbon black, and the curing agent, and curing them to obtain the epoxy resin wave-absorbing composite material.

公开(公告)号：US11866616B2

公开(公告)日：2024-01-09

申请号：US16702796

申请日：2019-12-04

Applicant: LUOYANG INSTITUTE OF CUTTING-EDGE TECHNOLOGY ,  LUOYANG CUTTING EDGE EQUIPMENT TECHNOLOGY LTD

Inventor： Ruopeng Liu ,  Zhiya Zhao ,  Lu Zhang ,  Yunxiang Zhang ,  Yan Hou

IPC: C09J163/00 ,  B05D1/18 ,  B05D3/00 ,  C09J9/00 ,  C09J11/04 ,  H05K9/00 ,  C08J7/00 ,  C08G59/24 ,  C08G59/50 ,  C08K3/04 ,  C08L83/12

CPC classification number: C09J163/00 ,  B05D1/18 ,  B05D3/007 ,  C08J7/00 ,  C09J9/00 ,  C09J11/04 ,  H05K9/0081 ,  B05D2201/02 ,  B05D2504/00 ,  C08G59/245 ,  C08G59/502 ,  C08G59/5033 ,  C08K3/04 ,  C08L83/12 ,  C09J2301/50

Abstract: Provided a wave-absorbing impregnation glue liquid, including: two-component epoxy resin, a solvent, a polyether siloxane, and a carbon powder; wherein a mass ratio of the two-component epoxy resin to the solvent is 1:3˜1:5, a mass ratio of the two-component epoxy resin to the carbon powder is 3:1˜6:1, and a mass fraction of the polyether siloxane in the wave-absorbing impregnation glue liquid is 0.05%˜0.2%. A wave-absorbing impregnation glue liquid, a wave-absorbing honeycomb and their preparation methods are further provided.