Invention Grant
- Patent Title: Structure to increase breakdown voltage of high electron mobility transistor
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Application No.: US16906109Application Date: 2020-06-19
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Publication No.: US11289592B2Publication Date: 2022-03-29
- Inventor: Ting-Chang Chang , Yu-Ching Tsao , Yu-Lin Tsai , Po-Hsun Chen , Yu-Shan Lin , Wen-Chung Chen
- Applicant: NATIONAL SUN YAT-SEN UNIVERSITY
- Applicant Address: TW Kaohsiung
- Assignee: NATIONAL SUN YAT-SEN UNIVERSITY
- Current Assignee: NATIONAL SUN YAT-SEN UNIVERSITY
- Current Assignee Address: TW Kaohsiung
- Agency: WPAT, PC
- Priority: TW109117356 20200525
- Main IPC: H01L29/778
- IPC: H01L29/778

Abstract:
A structure to increase the breakdown voltage of the high electron mobility transistor is provided to solve the problem of function loss under a high voltage state. The structure includes a substrate, a conducting layer located on the substrate, a gate insulating layer and an electric-field-dispersion layer. The upper portion of the conducting layer is an electron supply layer, and the lower portion of the conducting layer is an electron tunnel layer. The gate insulating layer is laminated on the electron supply layer. The electric-field-dispersion layer is laminated on the gate insulating layer. The dielectric constant of the electric-field-dispersion layer is smaller than that of the gate insulating layer. A gate electrode is located between the electric-field-dispersion layer and the gate insulating layer. A source and a drain electrodes are respectively electrically connected to the electric-field-dispersion layer, the gate insulating layer, the electron supply layer, and the electron tunnel layer.
Public/Granted literature
- US20210367068A1 STRUCTURE TO INCREASE BREAKDOWN VOLTAGE OF HIGH ELECTRON MOBILITY TRANSISTOR Public/Granted day:2021-11-25
Information query
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