Invention Grant
- Patent Title: Micro semiconductor chip, micro semiconductor structure, and transfer device
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Application No.: US16718982Application Date: 2019-12-18
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Publication No.: US11296259B2Publication Date: 2022-04-05
- Inventor: Chih-Ling Wu , Yi-Min Su , Shiang-Ning Yang
- Applicant: PlayNitride Display Co., Ltd.
- Applicant Address: TW Zhunan Township
- Assignee: PlayNitride Display Co., Ltd.
- Current Assignee: PlayNitride Display Co., Ltd.
- Current Assignee Address: TW Zhunan Township
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: TW108133180 20190916
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L25/075 ; H01L33/24 ; H01L33/36 ; H01L33/62 ; H01L33/20 ; H01L33/58 ; H01L33/54 ; H01L33/44

Abstract:
A micro semiconductor chip, a micro semiconductor structure, and a transfer device are provided. The micro semiconductor chip includes an epitaxial structure, a first-type electrode, a second-type electrode and a top light guide element. The epitaxial structure has a top surface, a bottom surface and a side surface. The top light guide element is disposed on the top surface of the epitaxial structure, wherein the top light guide element has a light extraction surface and a bottom surface, wherein the edge of the light extraction surface completely overlaps the edge of the bottom surface of the top light guide element. The light extraction surface is a curved surface, a combination of at least two curved surfaces, or a combination of at least one curved surface and at least one planar surface.
Public/Granted literature
- US20210083149A1 MICRO SEMICONDUCTOR CHIP, MICRO SEMICONDUCTOR STRUCTURE, AND TRANSFER DEVICE Public/Granted day:2021-03-18
Information query
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