Invention Grant
- Patent Title: Movable inlet for a fan
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Application No.: US16722275Application Date: 2019-12-20
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Publication No.: US11304329B2Publication Date: 2022-04-12
- Inventor: Bijendra Singh , Prakash Kurma Raju , Samarth Alva
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Patent Capital Group
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
Particular embodiments described herein provide for an electronic device that can be configured to include a first housing, a second housing, where the second housing includes a fan, an inlet, and actuators, and a hinge, where the hinge rotatably couples the first housing to the second housing. When the first housing is rotated over the inlet, the actuators lower the inlet to create a gap between the inlet and the first housing. In some examples, the inlet includes slats and when the first housing is rotated over the inlet, a distance between each of the slats increases from a first distance to a second distance.
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