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公开(公告)号:US20240410396A1
公开(公告)日:2024-12-12
申请号:US18329763
申请日:2023-06-06
Applicant: Intel Corporation
Inventor: Arnab Sen , Srinivasarao Konakalla , Samarth Alva , Amit Kumar , Rachit Garg , Bhavaneeswaran Anbalagan , Raghavendra S. Kanivihalli , Prasanna Pichumani
Abstract: Impeller architecture for a cooling fan and methodology for making same. The impeller architecture includes a plurality of blades, individual ones of the blades have a first end that is attached to a hub component in a sequential order, such that sequential first ends are attached to the circumference. An indexing function is applied to the sequential order, and blades or the spaces therebetween are modified accordingly to have a blade type based on their sequential location and the indexing function. The indexing function can be, in a non-limiting example, odd numbers or prime numbers.
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公开(公告)号:US12025971B2
公开(公告)日:2024-07-02
申请号:US17667551
申请日:2022-02-09
Applicant: Intel Corporation
Inventor: Navneet Singh , Samarth Alva , Amarjeet Kumar , Gaurav Hada
IPC: G05B19/4155 , H01L23/373 , H01L23/538 , H01R12/70 , H05K1/18
CPC classification number: G05B19/4155 , H01L23/3736 , H01L23/538 , H01R12/70 , G05B2219/40269 , G05B2219/45031 , H05K1/181 , H05K2201/10378
Abstract: An apparatus includes a memory interposer including a socket including an inner surface, one or more memories disposed on the inner surface, a bottom surface opposite to the inner surface, and pogo pins disposed on the bottom surface and respectively corresponding to the one or more memories, the pogo pins being configured to connect the one or more memories to a printed circuit board (PCB) including a semiconductor die. The apparatus further includes an intermediate thermal head attached to the memory interposer. The memory interposer is movable with respect to the intermediate thermal head.
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公开(公告)号:US11304329B2
公开(公告)日:2022-04-12
申请号:US16722275
申请日:2019-12-20
Applicant: Intel Corporation
Inventor: Bijendra Singh , Prakash Kurma Raju , Samarth Alva
IPC: H05K7/20
Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a first housing, a second housing, where the second housing includes a fan, an inlet, and actuators, and a hinge, where the hinge rotatably couples the first housing to the second housing. When the first housing is rotated over the inlet, the actuators lower the inlet to create a gap between the inlet and the first housing. In some examples, the inlet includes slats and when the first housing is rotated over the inlet, a distance between each of the slats increases from a first distance to a second distance.
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公开(公告)号:US11044548B2
公开(公告)日:2021-06-22
申请号:US16727854
申请日:2019-12-26
Applicant: Intel Corporation
Inventor: Samarth Alva , Sumod Cherukkate , Sachin Bedare
Abstract: In one embodiment, a portable computing device is described. The portable computing device includes a first surface comprising at least one user interface. The portable computing device also includes a second surface opposite the first surface. Further, the portable computing device includes at least one speaker port in the first surface. Further yet, the portable computing device includes a collapsible speaker chamber configured on the second surface opposite the at least one speaker port. Moreover, the portable computing device includes a speaker configured in the portable computing device between the speaker port and the collapsible speaker chamber.
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公开(公告)号:US20190129476A1
公开(公告)日:2019-05-02
申请号:US16232140
申请日:2018-12-26
Applicant: Intel Corporation
Inventor: Samarth Alva , Krishnakumar Varadarajan , Yogesh Channaiah
Abstract: Technologies for a hinge for a dual-screen clamshell computing device include a hinge having a drive shaft and a driven shaft. The drive shaft is fixed to a member such as a secondary display housing of the computing device. The driven shaft is rotatably coupled to another member such as a base housing of the computing device. The hinge includes a one-way needle bearing fixed to the same member as the driven shaft. The driven shaft passes through the one-way needle bearing, which allows free rotation of the driven shaft in one direction and prevents rotation of the driven shaft in the other direction. The hinge includes a coupling joint that selectively couples the drive shaft and the driven shaft. The computing device includes a trigger that is operable to selectively engage and disengage the coupling joint of the hinge. Other embodiments are described and claimed.
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公开(公告)号:US20240164063A1
公开(公告)日:2024-05-16
申请号:US18394829
申请日:2023-12-22
Applicant: Intel Corporation
Inventor: Samarth Alva , Prakash Kurma Raju , Shivaraju Neerati , Navneet Singh , Ravishankar Srikanth
CPC classification number: H05K7/20509 , G06F1/1681 , G06F1/1683 , H05K5/0226 , H05K5/0247
Abstract: An electronic device or a component thereof is described, which may include communication and/or thermal interconnects. The device may include hingedly coupled portions, where the interconnects are axially arranged (e.g., coincident) with respect to a hinge axis of the foldable electronic device.
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公开(公告)号:US11940851B2
公开(公告)日:2024-03-26
申请号:US17033736
申请日:2020-09-26
Applicant: Intel Corporation
Inventor: Samarth Alva , Yogesh Channaiah
CPC classification number: G06F1/1681 , G06F1/1618 , G06F1/1647 , H04M1/0268 , H05K5/0226 , H05K5/03 , G06F2200/1612
Abstract: In one embodiment, a hinge apparatus includes two curved rack apparatuses, each curved rack apparatus defining an arcuate surface and an arcuate set of gear teeth concentric with the arcuate surface, where the radius of curvature of the arcuate set of gear teeth being non-uniform. The hinge apparatus further includes a gear assembly that includes a first gear, a second gear, a third gear coupling the first and second gears, a fourth gear coupling the first gear and the arcuate set of gear teeth of the first curved rack apparatus, and a fifth gear coupling the second gear and the arcuate set of gear teeth of the second curved rack apparatus.
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公开(公告)号:US20230026512A1
公开(公告)日:2023-01-26
申请号:US17957420
申请日:2022-09-30
Applicant: Intel Corporation
Inventor: Mallari C. Hanchate , Amruta Ranade , Sandeep Masti , Prakash Kurma Raju , Samarth Alva
Abstract: Techniques for overlay surfaces for compute devices are disclosed. In one embodiment, an overlay surface on a base portion of a compute device can be moved from a folded or closed position (in which it does not cover the keyboard) to an unfolded or open position (in which it covers part of the keyboard). The base portion includes a touch sensor that allows the overlay surface to be used as a touch surface. In another embodiment, an overlay surface of a compute device is movable from one position adjacent a display of the compute device to another position adjacent a base of the compute device. The overlay surface is electrically switchable from a transparent state to an opaque state, allowing the display to be seen through it in one position and allowing it to be used as an opaque drawing surface in another position.
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公开(公告)号:US11175704B2
公开(公告)日:2021-11-16
申请号:US16736390
申请日:2020-01-07
Applicant: Intel Corporation
Inventor: Samarth Alva , Krishnakumar Varadarajan , Yogesh Channaiah
Abstract: Technologies for a hinge for a dual-screen clamshell computing device include a hinge having a drive shaft and a driven shaft. The drive shaft is fixed to a member such as a secondary display housing of the computing device. The driven shaft is rotatably coupled to another member such as a base housing of the computing device. The hinge includes a one-way needle bearing fixed to the same member as the driven shaft. The driven shaft passes through the one-way needle bearing, which allows free rotation of the driven shaft in one direction and prevents rotation of the driven shaft in the other direction. The hinge includes a coupling joint that selectively couples the drive shaft and the driven shaft. The computing device includes a trigger that is operable to selectively engage and disengage the coupling joint of the hinge. Other embodiments are described and claimed.
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公开(公告)号:US20210011527A1
公开(公告)日:2021-01-14
申请号:US17033736
申请日:2020-09-26
Applicant: Intel Corporation
Inventor: Samarth Alva , Yogesh Channaiah
Abstract: In one embodiment, a hinge apparatus includes two curved rack apparatuses, each curved rack apparatus defining an arcuate surface and an arcuate set of gear teeth concentric with the arcuate surface, where the radius of curvature of the arcuate set of gear teeth being non-uniform. The hinge apparatus further includes a gear assembly that includes a first gear, a second gear, a third gear coupling the first and second gears, a fourth gear coupling the first gear and the arcuate set of gear teeth of the first curved rack apparatus, and a fifth gear coupling the second gear and the arcuate set of gear teeth of the second curved rack apparatus.
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