- Patent Title: Thermal print head and method of manufacturing thermal print head
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Application No.: US16899059Application Date: 2020-06-11
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Publication No.: US11305553B2Publication Date: 2022-04-19
- Inventor: Isamu Nishimura
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JPJP2019-111099 20190614
- Main IPC: B41J2/335
- IPC: B41J2/335

Abstract:
A thermal print head includes: a substrate; a resistor layer supported by the substrate and including a plurality of heat generating portions arranged in a main scanning direction; a wiring layer supported by the substrate and forming an energizing path to the plurality of heat generating portions; and an insulating layer interposed between the substrate and the resistor layer, wherein the substrate has a cavity portion overlapping the plurality of heat generating portions when viewed in a thickness direction of the substrate.
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