Invention Grant
- Patent Title: TEM-based metrology method and system
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Application No.: US17170938Application Date: 2021-02-09
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Publication No.: US11309162B2Publication Date: 2022-04-19
- Inventor: Vladimir Machavariani , Michael Shifrin , Daniel Kandel , Victor Kucherov , Igor Ziselman , Ronen Urenski , Matthew Sendelbach
- Applicant: NOVA LTD.
- Applicant Address: IL Rehovot
- Assignee: NOVA LTD.
- Current Assignee: NOVA LTD.
- Current Assignee Address: IL Rehovot
- Agency: Alphapatent Associates, Ltd
- Agent Daniel J. Swirsky
- Main IPC: H01J37/26
- IPC: H01J37/26 ; G06T7/00 ; G06T7/60 ; H01J37/22 ; G06T15/20 ; G06T17/05 ; G06T7/246 ; G06T19/00

Abstract:
A metrology method for use in determining one or more parameters of a three-dimensional patterned structure, the method including performing a fitting procedure between measured TEM image data of the patterned structure and simulated TEM image data of the patterned structure, determining a measured Lamellae position of at least one measured TEM image in the TEM image data from a best fit condition between the measured and simulated data, and generating output data indicative of the simulated TEM image data corresponding to the best fit condition to thereby enable determination therefrom of the one or more parameters of the structure.
Public/Granted literature
- US20210217581A1 TEM-BASED METROLOGY METHOD AND SYSTEM Public/Granted day:2021-07-15
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