Invention Grant
- Patent Title: Wickless capillary driven constrained vapor bubble heat pipes
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Application No.: US16881409Application Date: 2020-05-22
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Publication No.: US11324139B2Publication Date: 2022-05-03
- Inventor: Sumita Basu , Shantanu D. Kulkarni , Prosenjit Ghosh , Konstantin I. Kouliachev
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Hanley, Flight & Zimmerman, LLC
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28D15/02 ; G06F1/20 ; H05K1/02 ; H01L21/48 ; H01L23/427 ; H01L23/538 ; H05K1/18 ; H05K3/00 ; F28D15/04 ; F28F13/16 ; F28C3/08 ; G06F1/16 ; H05K5/00 ; F28D21/00 ; F21V8/00 ; G02F1/1333

Abstract:
An example apparatus is disclosed that includes a base and a wickless capillary driven constrained vapor bubble heat pipe carried by the base. The wickless capillary driven constrained vapor bubble heat pipe includes a capillary, and the capillary has a longitudinal axis and a cross-sectional shape orthogonal to the longitudinal axis. The cross-sectional shape includes a first curved wall, a second curved wall, a first corner between a first straight wall and a second straight wall, and a second corner between a third straight wall and a fourth straight wall.
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