Invention Grant
- Patent Title: Semiconductor integrated circuit device
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Application No.: US16537842Application Date: 2019-08-12
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Publication No.: US11326917B2Publication Date: 2022-05-10
- Inventor: Isao Niwa , Yuji Kaneda , Yuzo Mizushima
- Applicant: Rohm Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Fish & Richardson P.C.
- Priority: JPJP2018-155383 20180822,JPJP2019-112637 20190618
- Main IPC: G01F1/667
- IPC: G01F1/667 ; H01L23/495 ; H03K5/24 ; H03F3/68 ; H03F3/45 ; H03K3/03 ; H01L23/00 ; H03B5/36 ; H03B5/24

Abstract:
A semiconductor integrated circuit device includes a first terminal arranged to accept an external input of an analog input signal, an amplifier configured to amplify the analog input signal to generate an amplified signal, a logic unit configured to generate a digital output signal that is in accordance with the amplified signal, and a second terminal arranged to externally output an analog output signal that is in accordance with the amplified signal. The first terminal is disposed at a first side of a package, and the second terminal is disposed at a second side which is different from the first side.
Public/Granted literature
- US20200064168A1 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE Public/Granted day:2020-02-27
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