Invention Grant
- Patent Title: Power module structure and assembling method thereof
-
Application No.: US17168030Application Date: 2021-02-04
-
Publication No.: US11330717B2Publication Date: 2022-05-10
- Inventor: Da Jin , Kun Jiang , Junguo Cui , Yahong Xiong
- Applicant: Delta Electronics, Inc.
- Applicant Address: TW Ot
- Assignee: Delta Electronics, Inc.
- Current Assignee: Delta Electronics, Inc.
- Current Assignee Address: TW Ot
- Agency: Kirton McConkie
- Agent Evan R. Witt
- Priority: CN202010123504.8 20200227,CN202011095568.8 20201014
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H05K1/11 ; H05K1/16 ; H01F27/26 ; H01F27/28 ; H01F27/29 ; H01F27/34 ; H05K1/18 ; H05K3/34

Abstract:
The present disclosure is related to a power module power structure and an assembling method thereof. The power module structure includes a first printed-circuit-board (PCB) assembly, a second PCB assembly, and a conductive connection component. The first PCB assembly includes a first circuit board, a power switch and a magnetic component. The first circuit board includes a first side, a second side and a through hole. The power switch is disposed on the first circuit board. The magnetic component includes a first magnetic core and a second magnetic core fastened on the first circuit board through the through hole. The second PCB assembly includes a second circuit board having a third side, a fourth side and a hollow slot passing therethrough. The second magnetic core is exposed through the hollow slot. The conductive connection component is disposed and electrically connected between the first PCB assembly and the second PCB assembly.
Public/Granted literature
- US20210274655A1 POWER MODULE STRUCTURE AND ASSEMBLING METHOD THEREOF Public/Granted day:2021-09-02
Information query