Invention Grant
- Patent Title: Thin film tunnel field effect transistors having relatively increased width
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Application No.: US16631811Application Date: 2017-09-15
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Publication No.: US11335705B2Publication Date: 2022-05-17
- Inventor: Prashant Majhi , Brian S. Doyle , Ravi Pillarisetty , Abhishek A. Sharma , Elijah V. Karpov
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- International Application: PCT/US2017/051841 WO 20170915
- International Announcement: WO2019/055027 WO 20190321
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L29/423 ; H01L29/78

Abstract:
Thin film tunnel field effect transistors having relatively increased width are described. In an example, integrated circuit structure includes an insulator structure above a substrate. The insulator structure has a topography that varies along a plane parallel with a global plane of the substrate. A channel material layer is on the insulator structure. The channel material layer is conformal with the topography of the insulator structure. A gate electrode is over a channel portion of the channel material layer on the insulator structure. A first conductive contact is over a source portion of the channel material layer on the insulator structure, the source portion having a first conductivity type. A second conductive contact is over a drain portion of the channel material layer on the insulator structure, the drain portion having a second conductivity type opposite the first conductivity type.
Public/Granted literature
- US20200168636A1 THIN FILM TUNNEL FIELD EFFECT TRANSISTORS HAVING RELATIVELY INCREASED WIDTH Public/Granted day:2020-05-28
Information query
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