An electronic component manufacturing apparatus has a holding member for holding an electronic component body, a surface plate, a moving unit that causes the holding member and the surface plate to relatively move, and a control unit that controls the moving unit. The control unit causes the moving unit to simultaneously perform a distance changing movement for changing, by shortening or extending, the distance between an end face of each electronic component body and a surface of the surface plate, and a position changing movement for changing a two-dimensional position where the end face of the electronic component body is projected on the surface of the surface plate in such a manner that the direction in which the two-dimensional position moves in parallel with the surface of the surface plate successively varies (for example, along a circular path).