Invention Grant
- Patent Title: Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the same
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Application No.: US16009266Application Date: 2018-06-15
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Publication No.: US11339258B2Publication Date: 2022-05-24
- Inventor: Chih-Wei Liao , Guan-Syun Tseng , Tsung-Hsien Lin , Ju-Ming Huang , Chen-Hua Yu
- Applicant: TAIWAN UNION TECHNOLOGY CORPORATION
- Applicant Address: TW Chupei
- Assignee: TAIWAN UNION TECHNOLOGY CORPORATION
- Current Assignee: TAIWAN UNION TECHNOLOGY CORPORATION
- Current Assignee Address: TW Chupei
- Agency: Ferrells, PLLC
- Agent Michael W. Ferrell; Anna L. Kinney
- Priority: TW107100199 20180103
- Main IPC: C08J5/24
- IPC: C08J5/24 ; C09D163/00 ; C09D5/18 ; B32B15/092 ; H05K1/03 ; H05K1/02 ; H05K3/02 ; C08L63/00 ; B32B15/08 ; B32B15/098 ; B32B15/14 ; C08G8/04 ; C08G59/40 ; C08G8/12 ; C08J7/04 ; C08L61/04 ; C08L61/06 ; C08K5/00 ; C08K5/51 ; C08K5/53 ; C08K3/013 ; C08K5/49 ; C08K5/5313 ; C09D161/04 ; C09D161/06
Abstract:
A resin composition is provided. The resin composition comprises the following components: (A) a halogen-free epoxy resin; (B) a hardener; and (C) a phosphorus-containing phenolic resin of the following formula (I): wherein m, n, l, R1, and R2 are as defined in the specification.
Public/Granted literature
- US20190203003A1 RESIN COMPOSITION, AND PRE-PREG, METAL-CLAD LAMINATE AND PRINTED CIRCUIT BOARD PREPARED USING THE SAME Public/Granted day:2019-07-04
Information query
