公开(公告)号：US11414532B2

公开(公告)日：2022-08-16

申请号：US16123509

申请日：2018-09-06

Applicant: TAIWAN UNION TECHNOLOGY CORPORATION

Inventor： Chih-Wei Liao ,  Guan-Syun Tseng ,  Tsung-Hsien Lin ,  Ju-Ming Huang

IPC: C08K5/357 ,  C08J5/24 ,  H05K1/03 ,  H05K3/02 ,  G01N17/00 ,  H05K1/02 ,  B32B15/092

Abstract: A resin composition is provided. The resin composition comprises the following constituents: (A) epoxy resin; (B) a compound of formula (I), in formula (I), R1 and R2 are independently —H, —CH3, or —C(CH3); and (C) an optional filler.

公开(公告)号：US10920008B2

公开(公告)日：2021-02-16

申请号：US16250422

申请日：2019-01-17

Applicant: TAIWAN UNION TECHNOLOGY CORPORATION

Inventor： Ju-Ming Huang ,  Chen-Hua Yu ,  Chang-Chien Yang ,  Guan-Syun Tseng ,  Chih-Wei Liao

IPC: C08G59/06 ,  C08G59/30 ,  C08G59/26 ,  C08G59/28 ,  C08K5/00 ,  C08K5/5397 ,  C08J5/24 ,  H05K3/00 ,  C08K5/5399 ,  C08K3/013

Abstract: A thermal-curable resin composition is provided. The thermal-curable resin composition comprises: (A) a thermal-curable resin component, which comprises: (a1) bismaleimide resin; (a2) cyanate ester resin; and (a3) epoxy resin, wherein the cyanate ester resin (a2) and the epoxy resin (a3) are respectively in an amount ranging from 50 parts by weight to 150 parts by weight and from 24 parts by weight to 51 parts by weight per 100 parts by weight of the bismaleimide resin (a1); and (B) a filler, wherein the filler (B) is in an amount ranging from 40 parts by weight to 55 parts by weight per 100 parts by weight of the dry weight of the resin composition; and wherein the resin composition has a dynamic viscosity of not higher than 800 Pa·s after being brought into a semi-cured state (B-stage), and the resin composition has a dissipation factor (Df) of not higher than 0.006 at 10 GHz after being cured completely.

公开(公告)号：US10563006B2

公开(公告)日：2020-02-18

申请号：US15664156

申请日：2017-07-31

Applicant: Taiwan Union Technology Corporation

Inventor： Guan-Syun Tseng ,  Ju-Ming Huang ,  Tsung-Hsien Lin ,  Chang-Chien Yang ,  Chih-Wei Liao

IPC: C08G59/62 ,  C08G59/40 ,  H05K1/03 ,  C08G59/32 ,  C08G59/34 ,  C08G59/68 ,  C08J5/24 ,  C08L63/04 ,  H05K1/02 ,  C08L63/00 ,  C08K3/36

Abstract: A resin composition is provided. The resin composition comprises an epoxy resin (A) and a first hardener (B) of the following formula (I): wherein Ar, R and n are as defined in the specification, and the molar ratio of the epoxy group of the epoxy resin to the active functional group of the first hardener ranges from about 1:0.4 to about 1:1.6.

公开(公告)号：US11643544B2

公开(公告)日：2023-05-09

申请号：US16133083

申请日：2018-09-17

Applicant: TAIWAN UNION TECHNOLOGY CORPORATION

Inventor： Chih-Wei Liao ,  Ju-Ming Huang ,  Guan-Syun Tseng

IPC: C08L63/00 ,  H05K1/03 ,  C08K5/3492 ,  C08K3/36 ,  C08K3/22 ,  C08K3/28 ,  C08K5/00 ,  C08J5/24 ,  C08K5/42 ,  C08K5/18

CPC classification number: C08L63/00 ,  C08J5/244 ,  C08J5/249 ,  C08K3/22 ,  C08K3/28 ,  C08K3/36 ,  C08K5/0066 ,  C08K5/3492 ,  H05K1/0373 ,  C08J2363/02 ,  C08K5/18 ,  C08K5/42 ,  C08L2201/02 ,  C08L2203/20

Abstract: A resin composition is provided. The resin composition includes the following constituents:



(A) an epoxy resin;
(B) an amino group-containing hardener; and
(C) a compound of formula (I),








wherein, R11 to R16 and A1 to A2 in formula (I) are as defined in the specification, and the amount of the compound (C) of formula (I) is about 10 parts by weight to about 85 parts by weight per 100 parts by weight of the epoxy resin (A).

公开(公告)号：US11001759B2

公开(公告)日：2021-05-11

申请号：US16009627

申请日：2018-06-15

Applicant: TAIWAN UNION TECHNOLOGY CORPORATION

Inventor： Chih-Wei Liao ,  Chang-Chien Yang ,  Tsung-Hsien Lin ,  Ju-Ming Huang

IPC: C09K21/12 ,  C08K5/5399 ,  C08K5/521 ,  C08K5/5313 ,  C08K3/36 ,  C08J3/24 ,  C08J5/24 ,  H05K1/03 ,  H05K3/02 ,  B32B5/02 ,  C08K5/523

Abstract: A resin composition is provided. The resin composition comprises the following constituents: (A) an epoxy resin, which has at least two epoxy functional groups per molecule; (B) a reactive flame retardant with (a DOPO functional group) in structure; and (C) a non-reactive phosphorus-containing flame retardant, which is compatible with the other constituents of the resin composition.

公开(公告)号：US11339258B2

公开(公告)日：2022-05-24

申请号：US16009266

申请日：2018-06-15

Applicant: TAIWAN UNION TECHNOLOGY CORPORATION

Inventor： Chih-Wei Liao ,  Guan-Syun Tseng ,  Tsung-Hsien Lin ,  Ju-Ming Huang ,  Chen-Hua Yu

IPC: C08J5/24 ,  C09D163/00 ,  C09D5/18 ,  B32B15/092 ,  H05K1/03 ,  H05K1/02 ,  H05K3/02 ,  C08L63/00 ,  B32B15/08 ,  B32B15/098 ,  B32B15/14 ,  C08G8/04 ,  C08G59/40 ,  C08G8/12 ,  C08J7/04 ,  C08L61/04 ,  C08L61/06 ,  C08K5/00 ,  C08K5/51 ,  C08K5/53 ,  C08K3/013 ,  C08K5/49 ,  C08K5/5313 ,  C09D161/04 ,  C09D161/06

Abstract: A resin composition is provided. The resin composition comprises the following components: (A) a halogen-free epoxy resin; (B) a hardener; and (C) a phosphorus-containing phenolic resin of the following formula (I): wherein m, n, l, R1, and R2 are as defined in the specification.

公开(公告)号：US10994516B2

公开(公告)日：2021-05-04

申请号：US15859829

申请日：2018-01-02

Applicant: TAIWAN UNION TECHNOLOGY CORPORATION

Inventor： Chih-Wei Liao ,  Hsien-Te Chen ,  Tsung-Hsien Lin ,  Ju-Ming Huang

IPC: B32B15/20 ,  C08L79/08 ,  H05K1/03

Abstract: A resin composition is provided. The resin composition comprises the following components: (A) epoxy resin; (B) a cross-linking agent; (C) bismaleimide resin (BMI) represented by the following formula (I): wherein R1 is an organic group; and (D) a resin represented by the following formula (II): wherein n is an integer of 1 to 10.

公开(公告)号：US20180044467A1

公开(公告)日：2018-02-15

申请号：US15664156

申请日：2017-07-31

Applicant: Taiwan Union Technology Corporation

Inventor： Guan-Syun Tseng ,  Ju-Ming Huang ,  Tsung-Hsien Lin ,  Chang-Chien Yang ,  Chih-Wei Liao

IPC: C08G59/62 ,  C08L63/04 ,  H05K1/02 ,  C08J5/24 ,  C08G59/34 ,  C08G59/40 ,  C08G59/68 ,  C08G59/32

CPC classification number: C08G59/621 ,  C08G59/3218 ,  C08G59/34 ,  C08G59/4014 ,  C08G59/4071 ,  C08G59/686 ,  C08J5/24 ,  C08J2363/00 ,  C08J2363/04 ,  C08J2463/00 ,  C08J2463/04 ,  C08J2463/08 ,  C08L63/00 ,  C08L63/04 ,  C08L2203/20 ,  C08L2205/02 ,  C08L2205/025 ,  C08L2205/035 ,  C08L2205/05 ,  H05K1/02 ,  H05K1/0326 ,  C08K3/36

Abstract: A resin composition is provided. The resin composition comprises an epoxy resin (A) and a first hardener (B) of the following formula (I): wherein Ar, R and n are as defined in the specification, and the molar ratio of the epoxy group of the epoxy resin to the active functional group of the first hardener ranges from about 1:0.4 to about 1:1.6.