A semiconductor device includes a leadframe, a semiconductor die attached to the leadframe, and an encapsulation material encapsulating the semiconductor die and a portion of the leadframe. The leadframe includes a first main face and a second main face opposite to the first main face. The leadframe includes leads wherein each lead includes a fully plated end face extending between an unplated first sidewall and an unplated second sidewall opposite to the first sidewall. The end face and the first and second sidewalls of each lead are perpendicular to the first and second main faces.