Invention Grant
- Patent Title: 3D NAND memory device and method of forming the same
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Application No.: US16853839Application Date: 2020-04-21
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Publication No.: US11342264B2Publication Date: 2022-05-24
- Inventor: Zhongwang Sun , Zhong Zhang , Wenxi Zhou , Zhiliang Xia
- Applicant: Yangtze Memory Technologies Co., Ltd.
- Applicant Address: CN Wuhan
- Assignee: Yangtze Memory Technologies Co., Ltd.
- Current Assignee: Yangtze Memory Technologies Co., Ltd.
- Current Assignee Address: CN Wuhan
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L21/768 ; H01L23/522 ; H01L23/535 ; H01L27/11519 ; H01L27/11556 ; H01L27/11565 ; H01L27/11582 ; H01L27/11575 ; H01L27/11573

Abstract:
A semiconductor device is provided. The semiconductor device includes a substrate, a stack of word line layers and insulating layers that are stacked alternatingly over the substrate, and channel structures formed in a first array region and a second array region of the stack. The first array region and the second array region are positioned at opposing sides of the stack. A first staircase is formed in a connection region of the stack over the substrate, where the connection region is arranged between the first and second array regions. A second staircase is formed in the connection region of the stack over the substrate, and the connection region in the stack includes a separation region between the first and second staircases.
Public/Granted literature
- US20210193574A1 3D NAND MEMORY DEVICE AND METHOD OF FORMING THE SAME Public/Granted day:2021-06-24
Information query
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