Invention Grant
- Patent Title: Substrate embedded magnetic core inductors and method of making
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Application No.: US16022894Application Date: 2018-06-29
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Publication No.: US11348718B2Publication Date: 2022-05-31
- Inventor: Srinivas Pietambaram , Kristof Darmawikarta , Gang Duan , Yonggang Li , Sameer Paital
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01F27/26
- IPC: H01F27/26 ; H01F27/42 ; H01L21/768 ; H01L23/64 ; H01F27/25 ; H01F27/245

Abstract:
Described are microelectronic devices including an embedded microelectronic package for use as an integrated voltage regulator with a microelectronic system. The microelectronic package can include a substrate and a magnetic foil. The substrate can define at least one layer having one or more of electrically conductive elements separated by a dielectric material. The magnetic foil can have ferromagnetic alloy ribbons and can be embedded within the substrate adjacent to the one or more of electrically conductive elements. The magnetic foil can be positioned to interface with and be spaced from the one or more of electrically conductive element.
Public/Granted literature
- US20200005987A1 SUBSTRATE EMBEDDED MAGNETIC CORE INDUCTORS AND METHOD OF MAKING Public/Granted day:2020-01-02
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