Invention Grant
- Patent Title: Silicon carbide semiconductor device and power converter
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Application No.: US16759731Application Date: 2018-08-23
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Publication No.: US11355627B2Publication Date: 2022-06-07
- Inventor: Yuichi Nagahisa , Shiro Hino , Hideyuki Hatta , Koji Sadamatsu
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Xsensus LLP
- Priority: JPJP2017-242641 20171219
- International Application: PCT/JP2018/031165 WO 20180823
- International Announcement: WO2019/123717 WO 20190627
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/16 ; H01L29/417 ; H01L29/66 ; H02M1/08 ; H02M7/5387

Abstract:
In SiC-MOSFETs including Schottky diodes, passage of a bipolar current to a well region in a terminal region cannot be sufficiently reduced, which may reduce the reliability of elements. A SiC-MOSFET including Schottky diodes includes a gate electrode formed, through a second insulating film thicker than a gate insulating film in an active region, on a separation region between a first well region in the active region that is the closest to the terminal region and a second well region in the terminal region, wherein the second well region has a non-ohmic connection to a source electrode. Thus, a decrease in the reliability of elements is prevented.
Public/Granted literature
- US20200312995A1 SILICON CARBIDE SEMICONDUCTOR DEVICE AND POWER CONVERTER Public/Granted day:2020-10-01
Information query
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