Invention Grant
- Patent Title: Hermetic chip on board
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Application No.: US17093119Application Date: 2020-11-09
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Publication No.: US11363722B2Publication Date: 2022-06-14
- Inventor: John M. Bedinger
- Applicant: RAYTHEON COMPANY
- Applicant Address: US MA Waltham
- Assignee: RAYTHEON COMPANY
- Current Assignee: RAYTHEON COMPANY
- Current Assignee Address: US MA Waltham
- Agency: Lando & Anastasi, LLP
- Main IPC: H05K3/22
- IPC: H05K3/22 ; H05K1/02 ; H05K1/09 ; H05K1/11 ; H05K1/18 ; H05K3/00 ; H05K3/30 ; H05K3/40 ; H05K3/46

Abstract:
A low permeability laminate film includes one or more low moisture permeability homogeneous polymer films with a total thickness between 0.5 and ten mils without glass or ceramic fillers and with a moisture permeability measured at 37° C. and 100% RH of less than 2.6 E-05 atm·cc·mm/in2·sec of air. The polymer film includes one of polychlorotrifluoroethylene, polytetrafluorethylene, fluorinated ethylene propylene, and perfluoro alkoxy alkane. The low permeability laminate film further includes a nanolaminate including alternate combinations of nanolaminate material that is selected from the group consisting of alumina, titanium dioxide, zirconium oxide, beryllium oxide, hafnium oxide, titanium oxide, silicon nitride, tantalum nitride, silica, parylene F, parylene AF-4, parylene HT® and PTFE (polytetrafluoroethylene). A resulting coated nanolaminate film has a moisture permeability less than an equivalent standard leak rate per square inch of 3.0 E-08 atm·cc/in2·sec of air.
Public/Granted literature
- US20210100107A1 HERMETIC CHIP ON BOARD Public/Granted day:2021-04-01
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