A method may include forming a via opening in a dielectric layer, depositing a first conductive layer along a bottom and a sidewall of the via opening, depositing a second conductive layer on top of the first conductive layer. The method may further include recessing the first conductive layer to form a trench and exposing a sidewall of the second conductive layer, depositing a non-conductive material in the trench, and depositing a phase change material layer on top of the dielectric layer. The top surface of the second conductive layer may be in direct contact with a bottom surface of the phase change material layer.