Invention Grant
- Patent Title: Plasma density monitor, plasma processing apparatus, and plasma processing method
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Application No.: US16883500Application Date: 2020-05-26
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Publication No.: US11410835B2Publication Date: 2022-08-09
- Inventor: Taro Ikeda , Eiki Kamata , Mikio Sato
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer; Tanya E. Harkins
- Priority: JPJP2019-098867 20190527
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/67

Abstract:
A plasma density monitor for monitoring a plasma density of surface wave plasma in a chamber accommodating a substrate and performs a plasma process on the substrate. The monitor includes: a monopole antenna installed to extend from a wall of the chamber toward an interior of the chamber and to be perpendicular to an inner wall surface of the chamber, and configured to receive a surface wave; a coaxial line configured to extract a detection value from a signal received by the monopole antenna; a length adjuster configured to adjust a length of the monopole antenna; and a controller configured to control the length adjuster so as to obtain a wavelength of the surface wave and the plasma density of the surface wave plasma from the wavelength of the surface wave.
Public/Granted literature
- US20200381224A1 PLASMA DENSITY MONITOR, PLASMA PROCESSING APPARATUS, AND PLASMA PROCESSING METHOD. Public/Granted day:2020-12-03
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