The present disclosure relates to a glass interposer module, an imaging device, and an electronic apparatus capable of reducing occurrence of distortion caused by thermal expansion during manufacture. A light transmissive member is charged between a glass interposer and a CMOS image sensor (CIS). Since rigidity of the glass interposer can be enhanced by this configuration, it is possible to suppress deflection of the CIS and also reduce influence of distortion given to a gyro sensor and the like which are equipped on the glass interposer, and therefore, erroneous detection of a gyro signal can be reduced. The present disclosure can be applied to a glass interposer module.