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    Functional device, acceleration sensor, and switch
    2.
    发明授权
    Functional device, acceleration sensor, and switch 有权
    功能设备，加速度传感器和开关

    公开(公告)号：US09446937B2

    公开(公告)日：2016-09-20

    申请号：US14554478

    申请日：2014-11-26

    Applicant: Sony Corporation

    Inventor： Akira Akiba ,  Mitsuo Hashimoto ,  Munekatsu Fukuyama

    IPC: G01C19/56 ,  B81B7/00 ,  H01L29/84 ,  G01P15/125 ,  B81B3/00

    CPC classification number: B81B3/0051 ,  B81B2203/0136

    Abstract: A functional device includes: a substrate; and a movable section configured to be held by the substrate and to be movable along a first direction in a surface of the substrate, in which the movable section includes a plurality of first shaft portions with relatively high rigidity, the plurality of first shaft portions are arranged side by side to extend along the first direction and to be line-symmetric to one another, and protrusions configured to brake the movable section are provided on substantially extended lines of the first shaft portions.

    Abstract translation: 功能元件包括：基板; 以及可移动部，其构造成由所述基板保持并且能够在所述基板的表面中沿着第一方向移动，所述可动部包括多个刚性相对较高的第一轴部，所述多个第一轴部为 并排布置成沿着第一方向延伸并且彼此线对称，并且构造成制动可移动部分的突起设置在第一轴部分的基本上延伸的线上。

    ELECTRONIC DEVICE, FUSE, AND ELECTRONIC APPARATUS
    3.
    发明申请
    ELECTRONIC DEVICE, FUSE, AND ELECTRONIC APPARATUS 有权
    电子设备，保险丝和电子设备

    公开(公告)号：US20150179371A1

    公开(公告)日：2015-06-25

    申请号：US14553290

    申请日：2014-11-25

    Applicant: Sony Corporation

    Inventor： Mitsuo Hashimoto ,  Akira Akiba ,  Hideo Niikura ,  Satoshi Mitani ,  Shinya Morita ,  Kunihiko Saruta

    IPC: H01H21/16

    CPC classification number: H01H85/463 ,  H01H1/0036 ,  H01H2001/0078 ,  H01H2085/0275

    Abstract: There is provided an electronic device including a first member formed to include at least a part of a substrate material, a second member formed to include at least a part of the substrate material and configured to be relatively movable with respect to the first member, and a fuse configured to include at least a part of the substrate material and configured to electrically connect the first member to the second member via the substrate material.

    Abstract translation: 提供了一种电子设备，其包括形成为包括至少一部分基板材料的第一构件，形成为包括至少一部分基板材料并被配置为相对于第一构件相对移动的第二构件，以及 熔丝，其被配置为包括所述基板材料的至少一部分并且经配置以经由所述基板材料将所述第一构件电连接到所述第二构件。

    ELECTROSTATIC DEVICE
    4.
    发明申请
    ELECTROSTATIC DEVICE 审中-公开

    公开(公告)号：US20170183219A1

    公开(公告)日：2017-06-29

    申请号：US15508913

    申请日：2015-08-18

    Applicant: Sony Corporation

    Inventor： Akira Akiba ,  Mitsuo Hashimoto ,  Shinya Morita ,  Munekatsu Fukuyama

    IPC: B81B5/00 ,  H02N1/04 ,  H02N1/00

    CPC classification number: B81B5/00 ,  B81B2203/04 ,  H01H59/0009 ,  H02N1/002 ,  H02N1/008 ,  H02N1/04

    Abstract: [Object] To provide an electrostatic device capable of improving device characteristics.[Solving Means] An electrostatic device according to an embodiment of the present technology includes an electrically conductive base material, a first conductor layer, a second conductor layer, and a bonding layer. The first conductor layer includes a first electrode portion and a first base portion and is connected to a signal line. The first base portion supports the first electrode portion and is disposed on the base material. The second conductor layer includes a second electrode portion and a second base portion and is connected to a reference potential. The second electrode portion is opposed to the first electrode portion in a first axis direction and configured to be movable relative to the first electrode portion in the first axis direction. The second base portion supports the second electrode portion and is disposed on the base material. The bonding layer is disposed between the base material and the first and second base portions and includes a plurality of first bonding portions that partially support at least the first base portion.

    ELECTROSTATIC DEVICE
    5.
    发明申请
    ELECTROSTATIC DEVICE 审中-公开

    公开(公告)号：US20190248645A1

    公开(公告)日：2019-08-15

    申请号：US16391193

    申请日：2019-04-22

    Applicant: Sony Corporation

    Inventor： Akira Akiba ,  Mitsuo Hashimoto ,  Shinya Morita ,  Munekatsu Fukuyama

    IPC: B81B5/00 ,  H02N1/00 ,  H02N1/04 ,  H01H59/00

    Abstract: [Object] To provide an electrostatic device capable of improving device characteristics.[Solving Means] An electrostatic device according to an embodiment of the present technology includes an electrically conductive base material, a first conductor layer, a second conductor layer, and a bonding layer. The first conductor layer includes a first electrode portion and a first base portion and is connected to a signal line. The first base portion supports the first electrode portion and is disposed on the base material. The second conductor layer includes a second electrode portion and a second base portion and is connected to a reference potential. The second electrode portion is opposed to the first electrode portion in a first axis direction and configured to be movable relative to the first electrode portion in the first axis direction. The second base portion supports the second electrode portion and is disposed on the base material. The bonding layer is disposed between the base material and the first and second base portions and includes a plurality of first bonding portions that partially support at least the first base portion.

    Contact point structure, electronic device, and electronic apparatus
    6.
    发明授权
    Contact point structure, electronic device, and electronic apparatus 有权

    公开(公告)号：US10301172B2

    公开(公告)日：2019-05-28

    申请号：US15573241

    申请日：2016-03-31

    Applicant: SONY CORPORATION

    Inventor： Mitsuo Hashimoto

    IPC: B81B3/00 ,  H01H59/00

    Abstract: To provide a contact point structure of an electronic device capable of maintaining stable impact resistance. There is provided a contact point structure including: a base portion that is a semiconductor substrate; a movable contact point portion that is supported by the base portion and is a part of a movable member capable of being driven in a predetermined direction; and a fixed contact point portion that faces the movable contact point portion. The fixed contact point portion includes a fixed portion that is supported by the base portion and an extending member that extends from the fixed portion and is capable of being displaced relative to the fixed portion.

    Waveguide interposer substrate having first and second conversion structures on opposed waveguide surfaces
    8.
    发明授权
    Waveguide interposer substrate having first and second conversion structures on opposed waveguide surfaces 有权
    波导插入器基板在相对的波导表面上具有第一和第二转换结构

    公开(公告)号：US09059492B2

    公开(公告)日：2015-06-16

    申请号：US13688728

    申请日：2012-11-29

    Applicant: Sony Corporation

    Inventor： Shinya Morita ,  Koichi Ikeda ,  Akira Akiba ,  Mitsuo Hashimoto

    IPC: H01P5/107 ,  H01P3/08

    CPC classification number: H01P3/081 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01P5/107

    Abstract: A waveguide includes: a waveguide portion including a first surface and a second surface that are opposed to each other; a first transmission line provided on the first surface of the waveguide portion; a second transmission line provided on the second surface of the waveguide portion; and a first conversion structure inputting a signal from the first transmission line to the waveguide portion and converting the signal.

    Abstract translation: 波导包括：包括彼此相对的第一表面和第二表面的波导部分; 设置在所述波导部分的所述第一表面上的第一传输线; 设置在所述波导部分的第二表面上的第二传输线; 以及将来自第一传输线的信号输入到波导部分并转换该信号的第一转换结构。

    Electrostatic device
    10.
    发明授权
    Electrostatic device 审中-公开

    公开(公告)号：US10669150B2

    公开(公告)日：2020-06-02

    申请号：US16391193

    申请日：2019-04-22

    Applicant: Sony Corporation

    Inventor： Akira Akiba ,  Mitsuo Hashimoto ,  Shinya Morita ,  Munekatsu Fukuyama

    IPC: B81B5/00 ,  H02N1/00 ,  H02N1/04 ,  H01H59/00 ,  B81B3/00

    Abstract: [Object] To provide an electrostatic device capable of improving device characteristics.[Solving Means] An electrostatic device according to an embodiment of the present technology includes an electrically conductive base material, a first conductor layer, a second conductor layer, and a bonding layer. The first conductor layer includes a first electrode portion and a first base portion and is connected to a signal line. The first base portion supports the first electrode portion and is disposed on the base material. The second conductor layer includes a second electrode portion and a second base portion and is connected to a reference potential. The second electrode portion is opposed to the first electrode portion in a first axis direction and configured to be movable relative to the first electrode portion in the first axis direction. The second base portion supports the second electrode portion and is disposed on the base material. The bonding layer is disposed between the base material and the first and second base portions and includes a plurality of first bonding portions that partially support at least the first base portion.

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