Invention Grant
- Patent Title: Using a thermoelectric component to improve memory sub-system performance
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Application No.: US16518267Application Date: 2019-07-22
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Publication No.: US11416048B2Publication Date: 2022-08-16
- Inventor: Michael R. Spica
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Lowenstein Sandler LLP
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H05K7/20 ; H05K1/02

Abstract:
First event information that is associated with an event that corresponds to a temperature of a memory sub-system is received. Whether the first event information associated with the event that corresponds to the temperature of the memory sub-system satisfies a first threshold condition is determined. Responsive to determining that the first event information associated with the event that corresponds to the temperature of the memory sub-system satisfies the first threshold condition, a thermoelectric component (TEC) is caused to change from an inactive state to an active state by decreasing a temperature at a bottom surface of the TEC that is coupled to the memory sub-system as a temperature at a top surface of the TEC increases.
Public/Granted literature
- US20210026425A1 USING A THERMOELECTRIC COMPONENT TO IMPROVE MEMORY SUB-SYSTEM PERFORMANCE Public/Granted day:2021-01-28
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