Invention Grant
- Patent Title: Semiconductor storing apparatus including multiple chips and continous readout method
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Application No.: US17165945Application Date: 2021-02-03
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Publication No.: US11430495B2Publication Date: 2022-08-30
- Inventor: Takamichi Kasai
- Applicant: Winbond Electronics Corp.
- Applicant Address: TW Taichung
- Assignee: Winbond Electronics Corp.
- Current Assignee: Winbond Electronics Corp.
- Current Assignee Address: TW Taichung
- Agency: JCIPRNET
- Priority: JPJP2020-074498 20200420
- Main IPC: G11C7/22
- IPC: G11C7/22 ; G11C7/10

Abstract:
A semiconductor storing apparatus capable of performing continuous readout between multiple chips in high speed is provided. A NAND-type flash memory includes the stacked multiple chips. Each of the chips includes: a readout part performing the continuous readout; an output buffer part outputting data readout from the readout part to input/output bus synchronously with a clock signal; and a final page detecting part detecting if readout pages are the final pages of the chips. The output buffer part responds to a detecting result of the final pages under a condition of performing the continuous readout between the chips. After outputting the data of the final pages through a first output buffer with a large driving capability, outputs or holds the data of the final pages through a second output buffer with a little driving capability.
Public/Granted literature
- US20210327481A1 SEMICONDUCTOR STORING APPARATUS AND READOUT METHOD Public/Granted day:2021-10-21
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