Invention Grant
- Patent Title: Light-emitting device having package structure with quantum dot material and manufacturing method thereof
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Application No.: US17060772Application Date: 2020-10-01
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Publication No.: US11430925B2Publication Date: 2022-08-30
- Inventor: Min-Hsun Hsieh , Tsung-Hong Lu
- Applicant: EPISTAR CORPORATION
- Applicant Address: TW Hsinchu
- Assignee: EPISTAR CORPORATION
- Current Assignee: EPISTAR CORPORATION
- Current Assignee Address: TW Hsinchu
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01L33/50
- IPC: H01L33/50 ; H01L33/60 ; H01L33/62

Abstract:
A light-emitting device includes a light-emitting unit comprising a top surface and a first side surface; a light-transmitting layer covers the top surface and the first side surface; a wavelength conversion structure disposed on the light-transmitting layer; a protective layer covering the second side surface and the light-transmitting layer; and a reflective layer surrounding the protective layer. The wavelength conversion structure includes a wavelength conversion layer, a first barrier layer disposed on the wavelength conversion layer, a second barrier layer disposed under the wavelength conversion layer, the wavelength conversion layer, the first barrier layer, and the second barrier layer are collectively formed a second side surface.
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Information query
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