A cleaning device for selectively applying a first medium to a surface includes a high pressure reservoir configured to store the first medium held under a storage pressure, a pulse nozzle configured to apply the first medium under the storage pressure in a pulsed manner to the surface, and a switching valve that includes a nozzle port and a high pressure reservoir port for selectively establishing a first connection between the high pressure reservoir and the pulse nozzle, and a feed port for establishing a second connection between the high pressure reservoir and a first medium source. The high pressure reservoir and the switching valve are structurally integrated in a reservoir valve module. The switching valve comprises a solenoid valve to switch between the first and the second connection when the high pressure reservoir port is under the storage pressure.