Invention Grant
- Patent Title: Ground path systems for providing a shorter and symmetrical ground path
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Application No.: US16400054Application Date: 2019-05-01
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Publication No.: US11434569B2Publication Date: 2022-09-06
- Inventor: Tuan Anh Nguyen , Jason M. Schaller , Edward P. Hammond, IV , David Blahnik , Tejas Ulavi , Amit Kumar Bansal , Sanjeev Baluja , Jun Ma , Juan Carlos Rocha
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: C23C16/505
- IPC: C23C16/505 ; C23C16/44 ; C23C16/458
Abstract:
Embodiments described herein relate to ground path systems providing a shorter and symmetrical path for radio frequency (RF) energy to propagate to a ground to reduce generation of the parasitic plasma. The ground path system bifurcates the processing volume of the chamber to form an inner volume that isolates an outer volume of the processing volume.
Information query
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