公开(公告)号：US11574826B2

公开(公告)日：2023-02-07

申请号：US16922874

申请日：2020-07-07

Applicant: Applied Materials, Inc.

Inventor： Jason M. Schaller ,  Steve Hongkham ,  Charles T. Carlson ,  Tuan A. Nguyen ,  Swaminathan T. Srinivasan ,  Khokan Chandra Paul

IPC: H01L21/67 ,  H01L21/687

Abstract: Exemplary substrate processing systems may include a factory interface and a load lock coupled with the factory interface. The systems may include a transfer chamber coupled with the load lock. The transfer chamber may include a robot configured to retrieve substrates from the load lock. The systems may include a chamber system positioned adjacent and coupled with the transfer chamber. The chamber system may include a transfer region laterally accessible to the robot. The transfer region may include a plurality of substrate supports disposed about the transfer region. Each substrate support of the plurality of substrate supports may be vertically translatable. The transfer region may also include a transfer apparatus rotatable about a central axis and configured to engage substrates and transfer substrates among the plurality of substrate supports. The chamber system may also include a plurality of processing regions vertically offset and axially aligned with an associated substrate support.

公开(公告)号：US20230005783A1

公开(公告)日：2023-01-05

申请号：US17940369

申请日：2022-09-08

Applicant: Applied Materials, Inc.

Inventor： Jason M. Schaller ,  Luke Bonecutter ,  Charles T. Carlson ,  Rajkumar Thanu ,  Karuppasamy Muthukamatchi ,  Jeff Hudgens ,  Benjamin Riordon

IPC: H01L21/687 ,  B65G47/90 ,  H01L21/67

Abstract: Exemplary substrate processing systems may include a transfer region housing defining a transfer region fluidly coupled with a plurality of processing regions. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a plurality of substrate supports disposed within the transfer region. The systems may also include a transfer apparatus having a central hub including a first shaft and a second shaft counter-rotatable with the first shaft. The transfer apparatus may include an eccentric hub extending at least partially through the central hub, and which is radially offset from a central axis of the central hub. The transfer apparatus may also include an end effector coupled with the eccentric hub. The end effector may include a plurality of arms having a number of arms equal to the number of substrate supports of the plurality of substrate supports.

公开(公告)号：US11264258B2

公开(公告)日：2022-03-01

申请号：US16877641

申请日：2020-05-19

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Jason M. Schaller ,  Robert Brent Vopat ,  David Blahnik ,  Benjamin B. Riordon ,  Paul E. Pergande

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/687

Abstract: Buffer chamber including robots, a carousel and at least one heating module for use with a batch processing chamber are described. Robot configurations for rapid and repeatable movement of wafers into and out of the buffer chamber and cluster tools incorporating the buffer chambers and robots are described.

公开(公告)号：US11049761B2

公开(公告)日：2021-06-29

申请号：US16673894

申请日：2019-11-04

Applicant: Applied Materials, Inc.

Inventor： Karl M. Brown ,  Jason M. Schaller

IPC: H01L21/687 ,  H01L21/67 ,  H01J37/32 ,  C23C14/50

Abstract: A shutter disk suitable for shield a substrate support in a physical vapor deposition chamber is provided. In one embodiment, the shutter disk includes a disk-shaped body having an outer diameter disposed between a top surface and a bottom surface. The disk-shape body includes a double step connecting the bottom surface to the outer diameter.

公开(公告)号：US20200279763A1

公开(公告)日：2020-09-03

申请号：US16877641

申请日：2020-05-19

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Jason M. Schaller ,  Robert Brent Vopat ,  David Blahnik ,  Benjamin B. Riordon ,  Paul E. Pergande

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/687

Abstract: Buffer chamber including robots, a carousel and at least one heating module for use with a batch processing chamber are described. Robot configurations for rapid and repeatable movement of wafers into and out of the buffer chamber and cluster tools incorporating the buffer chambers and robots are described.

公开(公告)号：US10699930B2

公开(公告)日：2020-06-30

申请号：US16127702

申请日：2018-09-11

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Jason M. Schaller ,  Robert Brent Vopat ,  David Blahnik ,  Benjamin B. Riordon ,  Paul E. Pergande

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/687

Abstract: Buffer chamber including robots, a carousel and at least one heating module for use with a batch processing chamber are described. Robot configurations for rapid and repeatable movement of wafers into and out of the buffer chamber and cluster tools incorporating the buffer chambers and robots are described.

公开(公告)号：US20190259638A1

公开(公告)日：2019-08-22

申请号：US16400516

申请日：2019-05-01

Applicant: Applied Materials, Inc.

Inventor： Jason M. Schaller ,  Robert Brent Vopat ,  Paul E. Pergande ,  Benjamin B. Riordon ,  David Blahnik ,  William T. Weaver

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/673

Abstract: Wafer cassettes and methods of use that provide heating a cooling to a plurality of wafers to decrease time between wafer switching in a processing chamber. Wafers are supported on a wafer lift which can move all wafers together or on independent lift pins which can move individual wafers for heating and cooling.

公开(公告)号：US20160355927A1

公开(公告)日：2016-12-08

申请号：US15163857

申请日：2016-05-25

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Robert Brent Vopat ,  Joseph Yudovsky ,  Jason M. Schaller

IPC: C23C16/458 ,  C23C16/455

CPC classification number: C23C16/4585 ,  C23C16/45551 ,  C23C16/4584 ,  H01L21/68764 ,  H01L21/68771 ,  H01L21/68785 ,  H01L21/68792

Abstract: Apparatus and methods for aligning large susceptors in batch processing chambers are described. Apparatus and methods for controlling the parallelism of a susceptor relative to a gas distribution assembly are also described.

Abstract translation: 描述了用于在批处理室中对准大型基座的装置和方法。 还描述了用于控制基座相对于气体分配组件的平行度的装置和方法。

公开(公告)号：US11443973B2

公开(公告)日：2022-09-13

申请号：US16922727

申请日：2020-07-07

Applicant: Applied Materials, Inc.

Inventor： Jason M. Schaller ,  Luke Bonecutter ,  Charles T. Carlson ,  Rajkumar Thanu ,  Karuppasamy Muthukamatchi ,  Jeff Hudgens ,  Benjamin Riordon

IPC: H01L21/68 ,  H01L21/687 ,  B65G47/90 ,  H01L21/67

Abstract: Exemplary substrate processing systems may include a transfer region housing defining a transfer region fluidly coupled with a plurality of processing regions. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a plurality of substrate supports disposed within the transfer region. The systems may also include a transfer apparatus having a central hub including a first shaft and a second shaft counter-rotatable with the first shaft. The transfer apparatus may include an eccentric hub extending at least partially through the central hub, and which is radially offset from a central axis of the central hub. The transfer apparatus may also include an end effector coupled with the eccentric hub. The end effector may include a plurality of arms having a number of arms equal to the number of substrate supports of the plurality of substrate supports.

公开(公告)号：US11434569B2

公开(公告)日：2022-09-06

申请号：US16400054

申请日：2019-05-01

Applicant: Applied Materials, Inc.

Inventor： Tuan Anh Nguyen ,  Jason M. Schaller ,  Edward P. Hammond, IV ,  David Blahnik ,  Tejas Ulavi ,  Amit Kumar Bansal ,  Sanjeev Baluja ,  Jun Ma ,  Juan Carlos Rocha

IPC: C23C16/505 ,  C23C16/44 ,  C23C16/458

Abstract: Embodiments described herein relate to ground path systems providing a shorter and symmetrical path for radio frequency (RF) energy to propagate to a ground to reduce generation of the parasitic plasma. The ground path system bifurcates the processing volume of the chamber to form an inner volume that isolates an outer volume of the processing volume.