Invention Grant
- Patent Title: Process for film deposition on a substrate with non-uniform overlapping subpulses of a precursor
-
Application No.: US17078119Application Date: 2020-10-23
-
Publication No.: US11447854B2Publication Date: 2022-09-20
- Inventor: Chiyu Zhu
- Applicant: ASM IP Holding B.V.
- Applicant Address: NL Almere
- Assignee: ASM IP Holding B.V.
- Current Assignee: ASM IP Holding B.V.
- Current Assignee Address: NL Almere
- Agency: Laine IP Oy
- Agent Mark W. Scott
- Main IPC: C23C14/54
- IPC: C23C14/54 ; C23C14/00 ; C23C14/34
Abstract:
A process for the uniform controlled growth of materials on a substrate that directs a plurality of pulsed flows of a precursor into a reaction space of a reactor to deposit the thin film on the substrate. Each pulsed flow is a combination of a first pulsed subflow and a second pulsed subflow of the same precursor, wherein a pulse profile of the second pulsed subflow overlaps at least a portion of a latter half of a pulse profile of the first pulsed subflow having a non-uniform pulse profile.
Public/Granted literature
- US20210123128A1 Normal pulse profile modification in a film deposition process Public/Granted day:2021-04-29
Information query
IPC分类:
