Invention Grant
- Patent Title: Characterizing integrated photonics devices
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Application No.: US17011401Application Date: 2020-09-03
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Publication No.: US11460372B2Publication Date: 2022-10-04
- Inventor: Alexandre D. Simard , Michel Poulin , Christine Latrasse
- Applicant: Ciena Corporation
- Applicant Address: US MD Hanover
- Assignee: Ciena Corporation
- Current Assignee: Ciena Corporation
- Current Assignee Address: US MD Hanover
- Agency: Young Basile Hanlon & MacFarlane, P.C.
- Main IPC: G01M11/00
- IPC: G01M11/00 ; G02B6/122 ; G02B6/12

Abstract:
An integrated circuit comprises: at least one photonic layer that includes one or more optical waveguides; a first optical coupler that couples at least a first optical mode outside of the photonic layer to a first waveguide in the photonic layer; a photonic device that includes one or more ports in the photonic layer; a first multi-port optical coupler that includes three or more ports in the photonic layer, including a first port optically coupled to the first optical coupler, a second port optically coupled to a first port of the photonic device, and a third port optically coupled to a first optical reflector configured to send substantially all optical power emitted from the third port of the first multi-port optical coupler back to the third port of the first multi-port optical coupler.
Public/Granted literature
- US20220065743A1 Characterizing Integrated Photonics Devices Public/Granted day:2022-03-03
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