Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
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Application No.: US15954903Application Date: 2018-04-17
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Publication No.: US11462387B2Publication Date: 2022-10-04
- Inventor: Yukihiro Mori
- Applicant: ASM IP Holding B.V.
- Applicant Address: NL Almere
- Assignee: ASM IP Holding B.V.
- Current Assignee: ASM IP Holding B.V.
- Current Assignee Address: NL Almere
- Agency: Studebaker & Brackett PC
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01J37/32 ; H01L21/3065 ; H01L21/67 ; H01L21/3213 ; H01L21/311
Abstract:
Examples of a substrate processing apparatus include a stage, an outer peripheral ring that surrounds the stage while provided with a gap between a side surface of the stage and the outer peripheral ring, a gas supply unit configured to supply gas from a lower side of the gap to an upper side of the gap, and an upper electrode provided above the stage.
Public/Granted literature
- US20190318910A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Public/Granted day:2019-10-17
Information query
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