Invention Grant
- Patent Title: Gate-all-around integrated circuit structures having underlying dopant-diffusion blocking layers
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Application No.: US16146785Application Date: 2018-09-28
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Publication No.: US11469299B2Publication Date: 2022-10-11
- Inventor: Glenn Glass , Anand Murthy , Biswajeet Guha , Dax Crum , Patrick Keys , Tahir Ghani , Susmita Ghose , Ted Cook, Jr.
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/02 ; H01L21/265 ; H01L21/306 ; H01L21/308 ; H01L29/08 ; H01L29/10 ; H01L29/165 ; H01L29/423 ; H01L29/66 ; H01L29/78 ; H01L21/027 ; H01L21/3213 ; H01L21/683 ; H01L21/8238 ; H01L27/092

Abstract:
Gate-all-around integrated circuit structures having underlying dopant-diffusion blocking layers are described. For example, an integrated circuit structure includes a vertical arrangement of horizontal nanowires above a fin. The fin includes a dopant diffusion blocking layer on a first semiconductor layer, and a second semiconductor layer on the dopant diffusion blocking layer. A gate stack is around the vertical arrangement of horizontal nanowires. A first epitaxial source or drain structure is at a first end of the vertical arrangement of horizontal nanowires. A second epitaxial source or drain structure is at a second end of the vertical arrangement of horizontal nanowires.
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