- Patent Title: Method for producing an optoelectronic semiconductor chip having structures at the radiation passage surface, and optoelectronic semiconductor chip having structures at the radiation passage surface
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Application No.: US16644962Application Date: 2018-09-03
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Publication No.: US11476389B2Publication Date: 2022-10-18
- Inventor: Michael Huber , Jana Sommerfeld , Martin Herz , Sebastian Hoibl , Christian Rumbolz , Albrecht Kieslich , Bernd Boehm , Georg Rossbach , Markus Broell
- Applicant: OSRAM OLED GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM OLED GmbH
- Current Assignee: OSRAM OLED GmbH
- Current Assignee Address: DE Regensburg
- Agency: Viering, Jentschura & Partner Mbb
- Priority: DE102017120493.8 20170906,DE102017121028.8 20170912,DE102018107615.0 20180329
- International Application: PCT/EP2018/073625 WO 20180903
- International Announcement: WO2019/048385 WO 20190314
- Main IPC: H01L33/24
- IPC: H01L33/24 ; H01L33/00

Abstract:
The invention relates to a method for producing an optoelectronic semiconductor chip comprising the following steps: providing a semiconductor body (1) having a radiation-permeable surface (1a), and introducing structures (2) into the semiconductor body (1) on the radiation-permeable surface (1a), wherein the structures (2) are quasi-regular.
Public/Granted literature
- US20210126163A1 METHOD FOR PRODUCING AN OPTOELECTRONIC SEMICONDUCTOR CHIP, AND OPTOELECTRONIC SEMICONDUCTOR CHIP Public/Granted day:2021-04-29
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