Invention Grant
- Patent Title: Substrate temperature non-uniformity reduction over target life using spacing compensation
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Application No.: US17177875Application Date: 2021-02-17
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Publication No.: US11492699B2Publication Date: 2022-11-08
- Inventor: Suhas Bangalore Umesh , Preetham Rao , Shirish A. Pethe , Fuhong Zhang , Kishor Kumar Kalathiparambil , Martin Lee Riker , Lanlan Zhong
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Main IPC: C23C14/50
- IPC: C23C14/50 ; C23C14/54 ; C23C14/34

Abstract:
Methods and apparatus for processing a plurality of substrates are provided herein. In some embodiments, a method of processing a plurality of substrates in a physical vapor deposition (PVD) chamber includes: performing a series of reflow processes on a corresponding series of substrates over at least a portion of a life of a sputtering target disposed in the PVD chamber, wherein a substrate-to-target distance in the PVD chamber and a support-to-target distance within the PVD chamber are each controlled as a function of the life of the sputtering target.
Public/Granted literature
- US20220259720A1 SUBSTRATE TEMPERATURE NON-UNIFORMITY REDUCTION OVER TARGET LIFE USING SPACING COMPENSATION Public/Granted day:2022-08-18
Information query
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