Invention Grant
- Patent Title: Multilayer substrate, interposer, and electronic device
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Application No.: US17368912Application Date: 2021-07-07
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Publication No.: US11510315B2Publication Date: 2022-11-22
- Inventor: Hiromasa Koyama , Ryosuke Takada , Atsushi Kasuya
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Keating & Bennett, LLP
- Priority: JPJP2017-206733 20171026
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/02 ; H05K1/18 ; H05K3/46

Abstract:
A multilayer substrate includes a base body including a first main surface, a first external electrode provided on the first main surface and made of metal foil, a first interlayer connection conductor, and a second interlayer connection conductor having higher conductivity than the first interlayer connection conductor. The base body includes insulating base material layers that are stacked on one another. The first interlayer connection conductor is provided at least in an insulating base material layer on which the first external electrode is provided, and is connected to the first external electrode. The second interlayer connection conductor is disposed inside the base body, and is connected to the first external electrode through the first interlayer connection conductor.
Public/Granted literature
- US20210345487A1 MULTILAYER SUBSTRATE, INTERPOSER, AND ELECTRONIC DEVICE Public/Granted day:2021-11-04
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