公开(公告)号：US12036776B2

公开(公告)日：2024-07-16

申请号：US17331744

申请日：2021-05-27

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yusuke Kamitsubo ,  Tsuyoshi Katsube ,  Ryosuke Takada

IPC: B32B27/08 ,  B32B3/02 ,  B32B3/26 ,  B32B7/025 ,  B32B7/027 ,  B32B15/08 ,  B32B27/18 ,  B32B27/30 ,  B32B37/10 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/32 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46

CPC classification number: B32B27/08 ,  B32B3/02 ,  B32B3/266 ,  B32B15/08 ,  B32B27/18 ,  B32B27/304 ,  B32B37/10 ,  H05K1/028 ,  H05K1/036 ,  H05K1/115 ,  H05K3/321 ,  H05K3/4046 ,  H05K3/4076 ,  H05K3/429 ,  H05K3/4623 ,  B32B7/025 ,  B32B7/027 ,  B32B2305/34 ,  B32B2305/55 ,  B32B2307/202 ,  B32B2307/536 ,  B32B2307/732 ,  B32B2457/08 ,  H05K2203/0235

Abstract: A resin multilayer substrate includes a laminate including resin layers including a first resin layer and a second resin layer that are laminated, a via conductor in the first resin layer, and a joint portion that includes at least a portion in the second resin layer and is joined to the via conductor. The joint portion is more brittle than the via conductor. A linear expansion coefficient of the second resin layer is larger than a linear expansion coefficient of the via conductor and a linear expansion coefficient of the joint portion, and is smaller than a linear expansion coefficient of the first resin layer.

公开(公告)号：US11089680B2

公开(公告)日：2021-08-10

申请号：US16850174

申请日：2020-04-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hiromasa Koyama ,  Ryosuke Takada ,  Atsushi Kasuya

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/18 ,  H05K3/46

Abstract: A multilayer substrate includes a base body including a first main surface, a first external electrode provided on the first main surface and made of metal foil, a first interlayer connection conductor, and a second interlayer connection conductor having higher conductivity than the first interlayer connection conductor. The base body includes insulating base material layers that are stacked on one another. The first interlayer connection conductor is provided at least in an insulating base material layer on which the first external electrode is provided, and is connected to the first external electrode. The second interlayer connection conductor is disposed inside the base body, and is connected to the first external electrode through the first interlayer connection conductor.

公开(公告)号：US12120817B2

公开(公告)日：2024-10-15

申请号：US17584589

申请日：2022-01-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Ryosuke Takada ,  Michiharu Nishimura

IPC: H05K1/03 ,  B32B3/26 ,  B32B27/08 ,  C08J5/04 ,  C08J5/18 ,  H05K1/02 ,  H05K3/46 ,  H05K1/11

CPC classification number: H05K1/0346 ,  B32B3/263 ,  B32B27/08 ,  C08J5/04 ,  C08J5/18 ,  H05K1/0271 ,  H05K1/034 ,  H05K1/0353 ,  H05K1/0373 ,  H05K3/4626 ,  C08J2325/04 ,  C08J2327/12 ,  C08J2365/00 ,  H05K1/118 ,  H05K2201/0141 ,  H05K2201/068 ,  H05K2203/065

Abstract: A resin multilayer substrate that includes a substrate having a plurality of laminated resin layers containing a norbornene-based polymer. A resin layer has an altered portion altered by a surface treatment and formed at an interface with a resin layer adjacent thereto in a lamination direction. An adhesion at an interface having the altered portion is greater than an adhesion at an interface with a non-altered portion.

公开(公告)号：US11659652B2

公开(公告)日：2023-05-23

申请号：US17318265

申请日：2021-05-12

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Ryosuke Takada

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/14 ,  H05K3/46 ,  H01R12/62

CPC classification number: H05K1/028 ,  H05K1/0353 ,  H05K1/148 ,  H05K3/4688 ,  H01R12/62 ,  H05K2201/0112 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2203/065 ,  H05K2203/107

Abstract: A resin substrate includes an insulating base material including opposing first and second main surfaces, at least one of which is parallel or substantially parallel to each of an X-axis direction and a Y-axis direction. The insulating base material is divided into first and second sections arranged in the X-axis direction. The first section includes, when evenly divided into three in a Z-axis direction, a first region closest to the first main surface, a second region closest to the second main surface, and a third region between the first region and the second region. A degree of resin molecular orientation in the first region in the Y-axis direction is greater than a degree of resin molecular orientation in the second section of the insulating base material in the Y-axis direction.

公开(公告)号：US11510315B2

公开(公告)日：2022-11-22

申请号：US17368912

申请日：2021-07-07

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hiromasa Koyama ,  Ryosuke Takada ,  Atsushi Kasuya

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/18 ,  H05K3/46

Abstract: A multilayer substrate includes a base body including a first main surface, a first external electrode provided on the first main surface and made of metal foil, a first interlayer connection conductor, and a second interlayer connection conductor having higher conductivity than the first interlayer connection conductor. The base body includes insulating base material layers that are stacked on one another. The first interlayer connection conductor is provided at least in an insulating base material layer on which the first external electrode is provided, and is connected to the first external electrode. The second interlayer connection conductor is disposed inside the base body, and is connected to the first external electrode through the first interlayer connection conductor.

公开(公告)号：US10959327B2

公开(公告)日：2021-03-23

申请号：US16412489

申请日：2019-05-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shinichi Araki ,  Hideyuki Taguchi ,  Hayato Noma ,  Ryosuke Takada

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/28 ,  H05K3/46

Abstract: A plate-shaped multilayer wiring substrate includes at least two resin layers stacked on top of each other and each including an insulating base and a conductive pattern provided on the insulating base, and a front surface layer joined onto the resin layers stacked. The front surface layer has a higher elastic modulus than an elastic modulus of the insulating bases. A joint interface between the resin layers and the front surface layer includes projections and depressions. Also, a method for manufacturing the plate-shaped multilayer wiring substrate includes a step of stacking, on top of resin layers, a front surface layer having a higher elastic modulus than an elastic modulus of the resin layers, and a step of performing pressing under pressure from above the front surface layer by using a flat surface in a heated state to join the resin layers and the front surface layer.

公开(公告)号：US11257779B2

公开(公告)日：2022-02-22

申请号：US16694053

申请日：2019-11-25

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Ryosuke Takada ,  Toshitaka Hayashi ,  Hiromasa Koyama

IPC: H05K1/11 ,  H01L23/00 ,  H05K1/02

Abstract: A multilayer wiring board includes a first insulating layer, a second insulating layer stacked on the first insulating layer, a via conductor inside each of the first insulating layer and the second insulating layer, and a conductive bonding layer that bonds the via conductors to each other. The first insulating layer is directly bonded to the second insulating layer, and a relationship a1>b1 is satisfied, where a1 is a maximum diameter of the bonding layer and b1 is a maximum diameter of the via conductor at an interface with the bonding layer.

公开(公告)号：US11001042B2

公开(公告)日：2021-05-11

申请号：US15907364

申请日：2018-02-28

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Ryosuke Takada ,  Hiroyuki Ohata

IPC: B32B37/02 ,  B32B27/08 ,  B32B27/16 ,  B32B27/00 ,  B05D3/06 ,  H05K1/03 ,  H05K3/46 ,  B29C35/08 ,  B32B27/36 ,  B05D1/12 ,  B05D3/02 ,  B05D7/04 ,  B05D7/00 ,  B29C39/12 ,  B29K67/00 ,  B29K105/00

Abstract: A method of manufacturing a treated sheet includes preparing a resin layer composite including a resin sheet and a thermoplastic resin layer supported on one surface of the resin sheet, applying a dispersion liquid including a powdery thermoplastic resin raw material onto a surface of the thermoplastic resin layer opposite to the resin sheet, and fusing the thermoplastic resin raw material to the thermoplastic resin layer by irradiating, with light from a flash lamp, a coating of the thermoplastic resin raw material formed in the applying step. The thermoplastic resin raw material has a melting point higher than the glass transition point of a resin that is a primary material of the resin sheet.

公开(公告)号：US10806033B2

公开(公告)日：2020-10-13

申请号：US16807307

申请日：2020-03-03

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kanto Iida ,  Shinichi Araki ,  Ryosuke Takada ,  Takahiro Baba

IPC: H05K1/14 ,  H05K1/02 ,  H05K3/36

Abstract: An interposer includes a stacked body including first and second mounting surfaces that face each other, a first electrode on the first mounting surface, and a second electrode on the second mounting surface. The stacked body includes flexible insulating layers stacked on each other, and a folded portion. The first and second electrodes are electrically connected to each other. The stacked body includes an upright portion between the first and second mounting surfaces and in which a stacking direction in which the insulating layers are stacked is parallel to the first and second mounting surfaces, and a bent portion bent in a plan view of the first and second mounting surfaces.

公开(公告)号：US11558958B2

公开(公告)日：2023-01-17

申请号：US17881702

申请日：2022-08-05

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yusuke Kamitsubo ,  Tsuyoshi Katsube ,  Ryosuke Takada

IPC: H05K1/03 ,  H05K1/02 ,  H05K3/46 ,  H05K3/00

Abstract: A stacked body includes a first resin layer including a thermoplastic first resin as a main material, a pattern including a conductor layer on one principal surface of the first resin layer, and a second resin layer including a thermoplastic second resin as a main material. The first resin layer is softer than the second resin layer. The first resin layer has a lower dielectric constant than the second resin layer. A pattern including the conductor layer is at least partially embedded in the first resin layer, and includes a portion in contact with the first resin layer along a layer direction (X-Y plane) of the first resin layer and a portion in contact with the first resin layer along a stacking direction (X-Z plane) of the first resin layer, the second resin layer, and the pattern including the conductor layer.