Invention Grant
- Patent Title: Semiconductor process
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Application No.: US17087646Application Date: 2020-11-03
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Publication No.: US11527652B2Publication Date: 2022-12-13
- Inventor: Zhi-Cheng Lee , Wei-Jen Chen , Kai-Lin Lee
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: CN201910187678.8 20190313
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/06 ; H01L29/165 ; H01L29/51 ; H01L29/66

Abstract:
A semiconductor structure includes at least one stacked fin structure, a gate and a source/drain. At least one stacked fin structure is located on a substrate, wherein the stacked fin structure includes a first fin layer and a second fin layer, and a fin dielectric layer is sandwiched by the first fin layer and the second fin layer. The gate is disposed over the stacked fin structure. The source/drain is disposed directly on the substrate and directly on sidewalls of the whole stacked fin structure. The present invention provides a semiconductor process formed said semiconductor structure.
Public/Granted literature
- US20210050441A1 SEMICONDUCTOR PROCESS Public/Granted day:2021-02-18
Information query
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