Invention Grant
- Patent Title: System apparatus and method for enhancing electrical clamping of substrates using photo-illumination
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Application No.: US16880518Application Date: 2020-05-21
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Publication No.: US11538714B2Publication Date: 2022-12-27
- Inventor: Qin Chen , Julian G. Blake , Michael W. Osborne , Steven M. Anella , Jonathan D. Fischer
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: KDB Firm PLLC
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L21/687 ; H01L21/683
Abstract:
An apparatus may include a clamp to clamp a substrate wherein the clamp is arranged opposing a back side of the substrate; and an illumination system, disposed to direct radiation to the substrate, when the substrate is disposed on the clamp, wherein the radiation comprises a radiation energy, equal to or above a threshold energy to generate mobile charge in the substrate, where the illumination system is disposed to direct radiation to the back side of the substrate.
Public/Granted literature
- US20210366759A1 SYSTEM APPARATUS AND METHOD FOR ENHANCING ELECTRICAL CLAMPING OF SUBSTRATES USING PHOTO-ILLUMINATION Public/Granted day:2021-11-25
Information query
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