Invention Grant
- Patent Title: Integrated circuit package with partitioning based on environmental sensitivity
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Application No.: US15946868Application Date: 2018-04-06
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Publication No.: US11538767B2Publication Date: 2022-12-27
- Inventor: Barry Jon Male , Paul Merle Emerson , Kurt Peter Wachtler
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Frank D. Cimino
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/00 ; H01L23/34 ; H01L23/495 ; H01L23/29 ; H01L23/057
Abstract:
An integrated circuit includes a lead frame, a first die, and a second die. The first die is bonded to and electrically connected to the lead frame. The second die is electrically connected to and spaced apart from the first die.
Public/Granted literature
- US20190206806A1 INTEGRATED CIRCUIT PACKAGE WITH PARTITIONING BASED ON ENVIRONMENTAL SENSITIVITY Public/Granted day:2019-07-04
Information query
IPC分类:
