公开(公告)号：US20210126585A1

公开(公告)日：2021-04-29

申请号：US17142573

申请日：2021-01-06

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Ricky A. Jackson ,  Kurt Peter Wachtler

IPC: H03B5/32 ,  H03H9/17 ,  H01L41/25 ,  H03H9/05 ,  H01L23/00 ,  H01L41/047 ,  H01L23/495 ,  H01L41/053 ,  H01L23/31 ,  H01L25/16 ,  H01L21/78 ,  H01L21/56

Abstract: A stacked-die oscillator package includes an oscillator circuit die having inner bond pads, and outer bond pads, and a bulk acoustic wave (BAW) resonator die having a piezoelectric transducer with a first and second BAW bond pad on a same side coupled to a top and bottom electrode layer across a piezoelectric layer. A first metal bump is on the first BAW bond pad and a second metal bump is on the second BAW bond pad flip chip bonded to the inner bond pads of the oscillator circuit die. A polymer material is in a portion of a gap between the BAW and oscillator circuit die.

公开(公告)号：US20200153387A1

公开(公告)日：2020-05-14

申请号：US16747679

申请日：2020-01-21

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Ricky A. Jackson ,  Kurt Peter Wachtler

IPC: H03B5/32 ,  H03H9/05 ,  H01L23/495 ,  H01L23/00 ,  H01L21/56 ,  H01L21/78 ,  H01L25/16 ,  H01L23/31 ,  H01L41/053 ,  H01L41/047 ,  H01L41/25 ,  H03H9/17

Abstract: A stacked-die oscillator package includes an oscillator circuit die having inner bond pads, and outer bond pads, and a bulk acoustic wave (BAW) resonator die having a piezoelectric transducer with a first and second BAW bond pad on a same side coupled to a top and bottom electrode layer across a piezoelectric layer. A first metal bump is on the first BAW bond pad and a second metal bump is on the second BAW bond pad flip chip bonded to the inner bond pads of the oscillator circuit die. A polymer material is in a portion of a gap between the BAW and oscillator circuit die.

公开(公告)号：US20170197823A1

公开(公告)日：2017-07-13

申请号：US15134574

申请日：2016-04-21

Applicant: Texas Instruments Incorporated

Inventor： Kurt Peter Wachtler ,  Makoto Yoshino ,  Ayumu Kuroda ,  Brian E. Goodlin ,  Karen Kirmse ,  Benjamin Cook ,  Genki Yano ,  Stuart Jacobsen

IPC: B81C1/00 ,  H01L21/02 ,  B81B7/00

CPC classification number: B81B7/0048 ,  B81B7/0054 ,  B81B2207/012 ,  B81B2207/097 ,  B81B2207/99 ,  B81C1/00325 ,  B81C2203/0136 ,  B81C2203/0154 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49541 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

公开(公告)号：US20210091012A1

公开(公告)日：2021-03-25

申请号：US17115734

申请日：2020-12-08

Applicant: Texas Instruments Incorporated

Inventor： Benjamin Stassen Cook ,  Steven Kummerl ,  Kurt Peter Wachtler

IPC: H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48 ,  H01L21/78 ,  H01L23/495

Abstract: A floating die package including a cavity formed through sublimation of a sacrificial die encapsulant and sublimation or separation of die attach materials after molding assembly. A pinhole vent in the molding structure is provided as a sublimation path to allow gases to escape, whereby the die or die stack is released from the substrate and suspended in the cavity by the bond wires only.

公开(公告)号：US20210005537A1

公开(公告)日：2021-01-07

申请号：US17027657

申请日：2020-09-21

Applicant: Texas Instruments Incorporated

Inventor： Kurt Peter Wachtler ,  Seunghyun Chae ,  Benjamin Stassen Cook

IPC: H01L23/495 ,  H01L23/00

Abstract: An integrated circuit die may be fabricating to have a plurality of contacts. A metal post may be formed on each of the plurality of contacts. A plurality of bumps may be formed on a plurality of contact regions of a leadframe or on the posts, in which the plurality of bumps are formed with a material that includes metal nanoparticles. The IC die may be attached to the leadframe by aligning the metal posts to the leadframe and sintering the metal nanoparticles in the plurality of bumps to form a sintered metal bond between each metal post and corresponding contact region of the leadframe.

公开(公告)号：US10233074B2

公开(公告)日：2019-03-19

申请号：US15867563

申请日：2018-01-10

Applicant: Texas Instruments Incorporated

Inventor： Kurt Peter Wachtler ,  Makoto Yoshino ,  Ayumu Kuroda ,  Brian E. Goodlin ,  Karen Kirmse ,  Benjamin Cook ,  Genki Yano ,  Stuart Jacobsen

IPC: B81B7/00 ,  B81C1/00 ,  H01L23/31 ,  H01L23/495

Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

公开(公告)号：US09896330B2

公开(公告)日：2018-02-20

申请号：US15134574

申请日：2016-04-21

Applicant: Texas Instruments Incorporated

Inventor： Kurt Peter Wachtler ,  Makoto Yoshino ,  Ayumu Kuroda ,  Brian E. Goodlin ,  Karen Kirmse ,  Benjamin Cook ,  Genki Yano ,  Stuart Jacobsen

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0048 ,  B81B7/0054 ,  B81B2207/012 ,  B81B2207/097 ,  B81B2207/99 ,  B81C1/00325 ,  B81C2203/0136 ,  B81C2203/0154 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49541 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

公开(公告)号：US20170330841A1

公开(公告)日：2017-11-16

申请号：US15248151

申请日：2016-08-26

Applicant: Texas Instruments Incorporated

Inventor： Benjamin Stassen Cook ,  Steven Kummerl ,  Kurt Peter Wachtler

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/78 ,  H01L21/48 ,  H01L23/495 ,  H01L23/31

CPC classification number: H01L23/562 ,  H01L21/4825 ,  H01L21/56 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/315 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/8592 ,  H01L2224/9205 ,  H01L2224/98 ,  H01L2924/00014 ,  H01L2924/18165 ,  H01L2224/83 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/206 ,  H01L2924/00012

Abstract: A floating die package including a cavity formed through sublimation of a sacrificial die encapsulant and sublimation or separation of die attach materials after molding assembly. A pinhole vent in the molding structure is provided as a sublimation path to allow gases to escape, whereby the die or die stack is released from the substrate and suspended in the cavity by the bond wires only.

公开(公告)号：US11498831B2

公开(公告)日：2022-11-15

申请号：US16941138

申请日：2020-07-28

Applicant: Texas Instruments Incorporated

Inventor： Kurt Peter Wachtler ,  Makoto Yoshino ,  Ayumu Kuroda ,  Brian E. Goodlin ,  Karen Kirmse ,  Benjamin Cook ,  Genki Yano ,  Stuart Jacobsen

IPC: B81B7/00 ,  B81C1/00 ,  H01L23/31 ,  H01L23/495

Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

公开(公告)号：US20210090940A1

公开(公告)日：2021-03-25

申请号：US17115730

申请日：2020-12-08

Applicant: Texas Instruments Incorporated

Inventor： Kurt Peter Wachtler ,  Anindya Poddar ,  Usman Mahmood Chaudhry

IPC: H01L21/768 ,  H01L23/498 ,  H05K1/18 ,  B81B7/00 ,  H01L23/31 ,  H01L21/822 ,  H01L23/00 ,  H01L23/04

Abstract: Electronic packages and related methods are disclosed. An example electronic package apparatus includes a substrate and an electronic component. A protective material is positioned on a first surface, a second surface and all side surfaces of the electronic component to encase the electronic component. An enclosure is coupled to the substrate to cover the protective material and the electronic component.