Invention Grant
- Patent Title: Solder material with two different size nickel particles
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Application No.: US17118008Application Date: 2020-12-10
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Publication No.: US11552042B2Publication Date: 2023-01-10
- Inventor: Alexander Heinrich , Alexander Roth , Catharina Wille
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102019134000.4 20191211,DE102020130638.5 20201119
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/00 ; H01L23/00 ; B23K35/30 ; B23K35/02 ; H01L23/495 ; H01L23/31 ; H01L21/56 ; B22F1/052 ; B23K101/40

Abstract:
A solder material may include nickel and tin. The nickel may include first and second amounts of particles. A sum of the particle amounts is a total amount of nickel or less. The first amount is between 5 at % and 60 at % of the total amount of nickel. The second amount is between 10 at % and 95 at % of the total amount of nickel. The particles of the first amount have a first size distribution, the particles of the second amount have a second size distribution, 30% to 70% of the first amount have a particle size in a range of about 5 μm around a particle size the highest number of particles have according to the first size distribution, and 30% to 70% of the second amount have a particle size in a range of about 5 μm around a particle size the highest number of particles have according to the second size distribution.
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