Invention Grant
- Patent Title: Conductive bridge random access memory and method of manufacturing the same
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Application No.: US16803351Application Date: 2020-02-27
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Publication No.: US11552245B2Publication Date: 2023-01-10
- Inventor: Chih-Yao Lin , Po-Yen Hsu , Bo-Lun Wu
- Applicant: Winbond Electronics Corp.
- Applicant Address: TW Taichung
- Assignee: Winbond Electronics Corp.
- Current Assignee: Winbond Electronics Corp.
- Current Assignee Address: TW Taichung
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L45/00
- IPC: H01L45/00 ; H01L27/24

Abstract:
A conductive bridge random access memory and its manufacturing method are provided. The conductive bridge random access memory includes a bottom electrode, an inter-metal dielectric, a resistance switching assembly, and a top electrode. The bottom electrode is disposed on a substrate, and the inter-metal dielectric is disposed above the bottom electrode. The resistance switching assembly is disposed on the bottom electrode and positioned in the inter-metal dielectric. The resistance switching assembly has a reverse T-shape cross-section. The top electrode is disposed on the resistance switching assembly and the inter-metal dielectric.
Public/Granted literature
- US20210273159A1 CONDUCTIVE BRIDGE RANDOM ACCESS MEMORY AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2021-09-02
Information query
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