Invention Grant
- Patent Title: Vacuum processing apparatus
-
Application No.: US17160801Application Date: 2021-01-28
-
Publication No.: US11557463B2Publication Date: 2023-01-17
- Inventor: Hiroyuki Kobayashi , Nobuya Miyoshi , Kazunori Shinoda , Kenji Maeda , Yutaka Kouzuma , Satoshi Sakai , Masaru Izawa
- Applicant: Hitachi High-Tech Corporation
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Tech Corporation
- Current Assignee: Hitachi High-Tech Corporation
- Current Assignee Address: JP Tokyo
- Agency: Mattingly & Malur, PC
- Priority: JP2016-023693 20160210
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/67

Abstract:
In a vacuum processing apparatus including: a vacuum container including a processing chamber therein; a plasma formation chamber; plate members being arranged between the processing chamber and the plasma formation chamber; and a lamp and a window member being arranged around the plate members, in order that a wafer and the plate members are heated by electromagnetic waves from the lamp, a bottom surface and a side surface of the window member is formed of a member transmitting the electromagnetic waves therethrough.
Public/Granted literature
- US20210151298A1 VACUUM PROCESSING APPARATUS Public/Granted day:2021-05-20
Information query