Invention Grant
- Patent Title: System-level camera module with electrical support and manufacturing method thereof
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Application No.: US17242211Application Date: 2021-04-27
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Publication No.: US11570336B2Publication Date: 2023-01-31
- Inventor: Mingzhu Wang , Bojie Zhao , Feifan Chen , Liang Ding , Nan Guo , Ye Wu , Heng Jiang
- Applicant: NINGBO SUNNY OPOTECH CO., LTD.
- Applicant Address: CN Ningbo
- Assignee: NINGBO SUNNY OPOTECH CO., LTD.
- Current Assignee: NINGBO SUNNY OPOTECH CO., LTD.
- Current Assignee Address: CN Ningbo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Main IPC: H04N5/225
- IPC: H04N5/225 ; H01L27/146

Abstract:
A camera module includes an optical lens, a light-sensitive chip and an electrical support. The electrical support includes a circuit module embedded in a support body to form an integral structure, a connecting member provided on the support body to electrically connect with the circuit module, and a camera component coupled at the support body and electrically connected to the connecting member. Therefore, the electrical support not only forms a circuit board to electrically connect with the camera component but only serves as a base to support the camera component.
Public/Granted literature
- US20210250474A1 System-Level Camera Module with Electrical Support and Manufacturing Method Thereof Public/Granted day:2021-08-12
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